Industry News | 2020-02-18 14:13:29.0
Michael Ford, Dale Lee, Joe O’Neil and S. Manian Ramkumar honored for their on-going leadership in IPC and the electronics industry
Industry News | 2023-01-30 16:15:38.0
In recognition of their extraordinary contributions to IPC and the electronics manufacturing industry, Garry McGuire, NASA and Teresa Rowe, IPC, were both inducted into the IPC Raymond E. Pritchard Hall of Fame at IPC APEX EXPO 2023. IPC's most prestigious honor, the Hall of Fame Award is given to individuals who have provided exceptional service and advancement to IPC and the electronics industry.
Industry News | 2011-04-20 21:26:17.0
IPC — Association Connecting Electronics Industries® presented Special Recognition, Distinguished Committee Leadership and Committee Service awards and a Presidents Award at IPC APEX EXPO™, held April 10–14, in Las Vegas.
Industry News | 2016-10-25 09:47:33.0
Learn about SMT assembly from SME Phil Zarrow in Chicago
Industry News | 2014-01-17 12:52:25.0
BEST Inc., has developed a line of Kapton™ SMT stencils for the prototype assembly market. These stencils, available in 4,5 and 6 thicknesses, present very flat coplanar printing surfaces for solder paste printing. . They are designed to be used when the there are very few boards to be made at one time and the pitch of the components is 1.00 and above.
Industry News | 2008-11-20 16:12:46.0
Integrated Ideas & Technologies, Inc. announces the Desktop Companion II
Industry News | 2010-01-13 20:08:34.0
MYDATA is proud to announce the certification of a new leaded solder paste from leading paste supplier, AIM, for the MYDATA MY500 Jet Printer. The certification is the latest success in AIM and MYDATA’s ongoing work to develop superior jet printing technologies, and follows the launch of AIM’s lead-free paste for the MY500 in 2009.
Industry News | 2013-11-15 17:04:20.0
The popularity of jet printing technology to apply solder paste to printed circuit boards is growing fast as more and more electronics manufacturers understand the key advantages over traditional methods of solder paste application, such as screen printing or dispensing. Today hundreds of electronic producers worldwide are using jet printing for a diverse range of applications – situations that demand speed, design freedom and high-quality solder joints.
Industry News | 2013-02-25 16:44:53.0
MYDATA has recently completed successful testing of a new low-temperature solder paste for jet printing.
Industry News | 2017-10-17 20:32:02.0
Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.
