Industry News | 2003-06-23 08:49:39.0
Three Organizations from the US, Europe and Japan to
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2010-09-22 15:01:40.0
Removing heat has become a major issue in the electronics industry as more highly integrated devices are jammed into less space and as high power devices, such as LEDs, become increasingly more common.
Industry News | 2018-10-18 08:59:34.0
PRINCIPLE OF SURFACE MOUNT PROCESS(SMT PROCESS)
Industry News | 2020-10-31 10:32:09.0
IPC Releases PCB Industry Results for September 2020
Industry News | 2019-12-16 22:23:49.0
In recent years, the automotive industry headlights using LED, especially the of large power LED chip more and more. Especially in the headlamp part of the large hernia lamp with high-power high-power LED panel, the effect is very good.
Industry News | 2012-02-07 16:20:22.0
Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present the paper titled “Effect of Cooling Rate on the Intermetallic Layer in Solder Joints” at the upcoming IPC APEX Expo.
Industry News | 2011-02-17 14:48:42.0
BTU International, a leading supplier of advanced thermal processing equipment and processes for the alternative energy and electronics manufacturing markets, today announced that its cumulative shipments for equipment used in firing of metallization for silicon photovoltaics have exceeded 5GW.
Industry News | 2014-03-25 18:52:14.0
An innovative Android-based operating system and high-resolution touchscreen user interface only begin to explain why Manncorp’s new MC-301 Benchtop Reflow Oven is among its hottest new products for 2014. By simulating the environment of an inline reflow system in a small footprint, the MC-301 is ideal for prototyping, manufacturability testing, and even short-run batch production. Its exclusive Android control app allows surface mount assemblers and product developers to meet solder paste manufacturers’ precise specifications for the preheat, soak, reflow, and cooling phases of their recommended profiles. Heating and cooling rates in each stage are also automatically calculated to easily verify compliance with component and material requirements.
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