Industry News: intermetallic thickness (Page 1 of 2)

SMT reflow oven process principle and introduction

Industry News | 2018-10-18 09:42:39.0

SMT reflow oven process principle and introduction

Flason Electronic Co.,limited

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Industry News | 2019-01-30 08:13:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

Cobar Expert Gerjan Diepstraten to Discuss Reflow Soldering during IPC Midwest 2012 Conference

Industry News | 2012-07-25 15:16:14.0

The Balver Zinn Group announces that Cobar BV’s Gerjan Diepstraten will present a paper titled “Reflow Soldering Equals Wave Soldering Plus One” at the upcoming IPC Midwest Exhibition & Conference

Balver Zinn

Nihon Superior's Keith Sweatman to Present at TMS Annual Conference

Industry News | 2012-02-15 19:03:23.0

Nihon Superior announces that its Senior Technical Advisor Keith Sweatman will present “The Effect of Composition on the Thickness Morphology and Growth of Interfacial Intermetallic in Pb-Free Solders” at the upcoming TMS Annual Conference. The presentation will take place during the session, titled “Pb-Free Solders and Other Materials for Emerging Interconnect and Packaging Technologies: Solder Alloy Design for Challenging Applications”.

Nihon Superior Co., Ltd.

Metcal introduces the new CV-500 Connection Validation™ Soldering System

Industry News | 2018-10-11 19:50:17.0

Metcal is pleased to introduce the new CV-500 Connection Validation™ Soldering System, the companion station to the CV-5210 CV Soldering System. The CV-500 packs all of the Connection Validation technology into a compact, economical housing.

Metcal

Nihon Superior to Present at SMTA International 2011

Industry News | 2011-10-16 00:20:48.0

Nihon Superior announces that Keith Sweatman will present a paper titled “The Effect of Microalloy Additions on the Morphology and Growth of Interfacial Intermetallic in Low-Ag and No-Ag Pb-Free Solders” at the upcoming SMTA International 2011.

Nihon Superior Co., Ltd.

Metcal Wins Its Fifth Award for Connection Validation

Industry News | 2017-11-15 20:16:33.0

Metcal announces that it was awarded a 2017 Global Technology Award in the category of Hand Soldering for its CV-5200 Soldering and Rework Systems with Connection Validation technology. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. This marks the company’s fifth award since its introduction at the beginning of 2017.

Metcal

Nihon Superior to Display Complete Range of SN100C Soldering Materials at SMTA International 2008

Industry News | 2008-08-07 15:26:07.0

Nihon Superior will feature a new, expanded range of SN100C products with FCT Assembly, one of its US SN100C Global Partners, in booth 125 at the upcoming SMTA International exhibition and conference.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit Advanced Soldering Materials at INTERNEPCON JAPAN 2011

Industry News | 2011-01-14 13:06:07.0

Nihon Superior Co. Ltd. will exhibit in Booth # East 30-14 at the upcoming INTERNEPCON JAPAN, scheduled to take place January 19-21, 2011 at the Tokyo Big Sight in Tokyo, Japan.

Nihon Superior Co., Ltd.

Nihon Superior to Showcase Advanced Soldering Materials at IPC APEX EXPO 2011

Industry News | 2011-03-14 17:59:18.0

Nihon Superior Co. Ltd. will exhibit in Booth #259 at the upcoming IPC APEX EXPO, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.

Nihon Superior Co., Ltd.

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