Industry News | 2001-11-19 05:54:43.0
Supporting electronics manufacturing efficiency and cost reduction
Industry News | 2008-05-29 11:34:27.0
Bangkok, Thailand � May 27, 2008 � Reed Exhibitions, the NEPCON events in China organizer, announces that visitors will not have to wait long for the next key NEPCON Asia event, with NEPCON Penang in Malaysia from 3-6th June. With the promise of new products, new technologies and the new business this will bring, Penang is set to deliver the largest ever NEPCON event in Malaysia.
Industry News | 2012-02-23 16:13:22.0
As electronic assemblers struggle to cope with increasingly complex packages and board designs, MYDATA reports a surge of interest in its jet printing technology. Software-controlled and stencil free, the technology is now used in 25 countries and hundreds of plants worldwide. In 2011, MYDATA’s system sales increased by 47 percent - a record year representing gains in market share for its entire SMT product line, including a strong growth for jet printing equipment.
Industry News | 2012-12-07 13:52:19.0
Hitachi high-speed, high performance solder paste printers and Koh Young Technology's 3D Solder Paste Inspection (SPI) systems can now "talk" to one another via Koh Young's award-winning Closed Loop Interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them at the printer.
Industry News | 2013-12-18 15:10:17.0
Koh Young Technology has strengthened its position in the high and mid-range segments of the 3D AOI market, and increased its sales revenue in 2013 when compared to last year's performance, it is announced today.
Industry News | 2014-04-02 20:56:21.0
Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.
Industry News | 2014-06-25 16:44:39.0
National Electronics Week is excited to publish their first look at the 2015 floor plan. With The Pavilion Hall booked for next year’s show there is over 400 extra square meters on the show floor up for grabs this time around. Not only that but with the return of our 4 Sector partners running the technical content seminars there will be more to see than ever before.
Industry News | 2015-07-01 15:44:06.0
Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.
Industry News | 2015-08-20 08:37:19.0
Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.
Industry News | 2015-10-28 12:35:57.0
Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability.
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