Industry News: korea pcb (Page 12 of 15)

Valor Opens New Sales Subsidiary in Singapore

Industry News | 2001-11-19 05:54:43.0

Supporting electronics manufacturing efficiency and cost reduction

Valor Computerized Systems

NEPCON Penang Marks the Way Forward with Largest Ever Electronics Event

Industry News | 2008-05-29 11:34:27.0

Bangkok, Thailand � May 27, 2008 � Reed Exhibitions, the NEPCON events in China organizer, announces that visitors will not have to wait long for the next key NEPCON Asia event, with NEPCON Penang in Malaysia from 3-6th June. With the promise of new products, new technologies and the new business this will bring, Penang is set to deliver the largest ever NEPCON event in Malaysia.

Reed Exhibitions

MYDATA Says Interest in Jet printing is Reaching a Tipping Point – Sales Up 47%.

Industry News | 2012-02-23 16:13:22.0

As electronic assemblers struggle to cope with increasingly complex packages and board designs, MYDATA reports a surge of interest in its jet printing technology. Software-controlled and stencil free, the technology is now used in 25 countries and hundreds of plants worldwide. In 2011, MYDATA’s system sales increased by 47 percent - a record year representing gains in market share for its entire SMT product line, including a strong growth for jet printing equipment.

Mycronic Technologies AB

HITACHI Solder Paste Printers, Koh Young SPI Systems Interface for ‘On-the-fly’ Print Process Optimization

Industry News | 2012-12-07 13:52:19.0

Hitachi high-speed, high performance solder paste printers and Koh Young Technology's 3D Solder Paste Inspection (SPI) systems can now "talk" to one another via Koh Young's award-winning Closed Loop Interface process control software. The process control software brings the SPI system and the printer together via a closed-loop communications link to not only identify defects in solder paste printing, but correct them at the printer.

Hitachi High Technologies America, Inc.

Koh Young Technology Reports Growth, Increased Market Share

Industry News | 2013-12-18 15:10:17.0

Koh Young Technology has strengthened its position in the high and mid-range segments of the 3D AOI market, and increased its sales revenue in 2013 when compared to last year's performance, it is announced today.

Koh Young America, Inc.

Indium Corporation Technology Experts to Present at Southeast Asia Technical Conference

Industry News | 2014-04-02 20:56:21.0

Indium Corporation's Dr. Ning-Cheng Lee, vice president of technology; Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager will present at the SMTA Southeast Asia Technical Conference on Electronics Assembly April 8-10 in Penang, Malaysia.

Indium Corporation

National Electronics Week 2015 – First Glimpse at the Floor Plan

Industry News | 2014-06-25 16:44:39.0

National Electronics Week is excited to publish their first look at the 2015 floor plan. With The Pavilion Hall booked for next year’s show there is over 400 extra square meters on the show floor up for grabs this time around. Not only that but with the return of our 4 Sector partners running the technical content seminars there will be more to see than ever before.

NEW Events Ltd

Nordson MARCH Introduces the SPHERE Series Plasma Treatment Systems for Semiconductor Applications

Industry News | 2015-07-01 15:44:06.0

Nordson MARCH, a Nordson company (NASDAQ: NDSN)announces its new SPHERE™ Series plasma systems for wafer-level and 3D packaging applications. Based on Nordson MARCH's TRAK™ Series, the new series consists of the TrophoSPHERE™ and StratoSPHERE™ plasma treatment systems. The systems perform descum, ashing (photoresist/polymer stripping), dielectric etch, wafer bumping, organic contamination removal, and wafer destress. Both systems support automated handling and processing of round or square wafers and can process thin wafers with or without a carrier, depending upon the wafer thickness.

MARCH Products | Nordson Electronics Solutions

Nordson MARCH StratoSPHERE Plasma Treatment System Expands Up to 6 Chambers for Increased Throughput and Flexibility

Industry News | 2015-08-20 08:37:19.0

Nordson MARCH announces that its StratoSPHERE™ Series plasma treatment equipment for wafer-level packaging and 3D packaging applications can now be configured in two, four, and even six chamber configurations for increased throughput and flexibility. The SPHERE™ plasma systems provide surface preparation and elimination of contamination for ashing, descum, bump, organic contamination removal, and wafer destress during semiconductor manufacturing operations, especially for applications such as 2.5D and 3D wafer-level fan-out.

MARCH Products | Nordson Electronics Solutions

Indium Corporation Discusses Enhanced Electronics Manufacturing Productivity and Profitability Through Materials Selection

Industry News | 2015-10-28 12:35:57.0

Indium Corporation announces the release of its newest informational video that provides real-world examples of how solder materials performance affects electronics manufacturing productivity and profitability.

Indium Corporation


korea pcb searches for Companies, Equipment, Machines, Suppliers & Information

Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider

1750 Mitchell Ave.
Oroville, CA USA

Phone: (888) 406-2830