Industry News: l and patterns (Page 1 of 27)

GPD Global's PCD Technology Is Proven Compatible with Silver-filled Electrical and Thermal Epoxies

Industry News | 2010-12-07 14:53:07.0

GPD Global announces that its Positive Cavity Displacement (PCD) technology is proven with silver-filled electrically and thermally conductive adhesives.

GPD Global

GPD Global to Demonstrate Equipment for the LED and Lighting Industry at the Strategies in Light Expo

Industry News | 2013-01-11 17:04:51.0

GPD Global will exhibit in Booth #739 at the upcoming Strategies in Light conference and exhibition, scheduled to take place February 12-14, 2013 at the Santa Clara Convention Center in California.

GPD Global

XEMICS' New 433MHz and 868MHz ETSI/FCC Compliant RF Modules

Industry News | 2003-05-22 08:14:29.0

RF module reference designs have been developed so that the customer can take the radio design and drop it right into their PCB or build a separate module

SMTnet

Shipley Company Announces New Appointments for Printed Wiring Board Business in North America and Europe

Industry News | 2003-05-02 08:58:57.0

Bob Ferguson has been appointed PWB General Manager, North America.

SMTnet

MIRTEC to Unveil Revolutionary Inspection Technologies for Perfect Solder Joints and 30% Productivity Boost at productronica

Industry News | 2023-11-13 12:28:17.0

MIRTEC announces the development of groundbreaking inspection technologies that it will unveil at productronica 2023, scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany. The new systems address critical challenges in 3D inspection performance of solder joints, inspection speed for tall component inspections, and measurement range limitations, offering manufacturers the perfect solution for enhanced quality and productivity.

MIRTEC Corp

MIRTEC to Exhibit Award-Winning Line of 3D AOI and SPI Inspection Systems at SMTAI 2013

Industry News | 2013-09-13 17:01:33.0

MIRTEC, “The Global Leader in Inspection Technology”, will exhibit its award-winning line of 3D AOI and SPI Inspection Systems at SMTAI 2013 booth #722. This three-day event is scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.

MIRTEC Corp

MIRTEC to Exhibit Complete Line of Technologically Advanced 3D AOI and SPI Inspection Systems at IPC APEX 2017

Industry News | 2017-01-11 18:22:38.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #3101 at the 2017 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 14-16, 2017 at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2022

Industry News | 2021-12-21 14:45:26.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1122 at the 2022 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 25-27, 2022, at the San Diego Convention Center.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at APEX 2023

Industry News | 2022-12-14 12:21:04.0

MIRTEC will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #1841 at the 2023 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Jan. 24-26, 2023, at the San Diego Convention Center in California.

MIRTEC Corp

MIRTEC to Display Award-Winning 3D AOI and SPI Solutions at the SMTA Guadalajara Expo 2023

Industry News | 2023-09-25 14:05:43.0

MIRTEC is pleased to announce its participation in the upcoming SMTA Guadalajara Expo on Wednesday, Oct. 25, 2023. The event is scheduled to take place at Expo Guadalajara in Jalisco, Mexico. In Booth 319, MIRTEC will feature a total of four (4) Inspection Systems specifically designed to address the full spectrum of inspection requirements associated with the Electronics Manufacturing Industry:

MIRTEC Corp

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