Industry News | 2003-03-04 08:08:23.0
In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.
Industry News | 2003-03-27 08:15:33.0
Modular Embedded Circuit Board from parvus Enables Local Device Fingerprint Biometrics
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2009-03-12 18:25:36.0
The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.
Industry News | 2010-02-17 18:45:59.0
The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.
Industry News | 2008-05-01 11:14:36.0
Component packaging technology continues to decrease in size (length, width, thickness), interconnection density per unit area is increasing (thinner PCB�s, smaller lines & spaces), functional performance is increasing (thermal, mechanical, electrical) at the same time as assembly processes are changing to lead-free assembly and other legislated requirements.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2019-01-17 20:31:55.0
IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES 2019 to be held on Wednesday, September 11 in Philadelphia, Pa.
Industry News | 2020-02-18 15:11:08.0
IPC invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts for IPC E-TEXTILES 2020, to be held September 29-30, 2020 at the University of Minnesota Coffman Memorial Union in Minneapolis, Minn.
Industry News | 2019-03-03 18:40:55.0
IPC – Association Connecting Electronics Industries® invites innovators, technologists, materials suppliers, electrical engineers and academicians to submit technical conference abstracts and educational course proposals for IPC E-TEXTILES Europe 2019 to be held on November 12, 2019 in Munich, Germany.
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