Industry News | 2009-09-17 17:02:12.0
EAST HANOVER, NJ – Zymet has introduced a new reworkable underfill encapsulant, CN-1728, designed to underfill Package-on-Package (POP) assemblies. Underfilled POP’s have greater difficulty in passing thermal cycle tests than underfilled BGA’s. Compared to earlier generation underfills, CN-1728 has a lower coefficient of thermal expansion and higher Tg, and better compatibility with flux residues, both of which contribute to its superior thermal cycle performance.
Industry News | 2009-04-09 22:35:29.0
The current economic climate, though challenging, certainly hasn't deterred the technology specialists at Henkel from continuing on an aggressive R&D path. As evidenced by an impressive five award wins during last week's APEX show in Las Vegas, Nevada, Henkel's commitment to innovation and materials advance is stronger than ever.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2021-01-05 10:57:10.0
The Innodisk 3TE7 and 3TG6-P Utilize Industrial-Grade 3D TLC NAND from Toshiba with a 3000 P/E Cycle Number for Increased Endurance
Industry News | 2014-12-12 12:24:17.0
PNC Inc. has obtained a new Horizontal Conveyorized CO-BRA BOND In-line Oxide Replacement line from IPS (Integrated Process Systems). The machine is capable of coating 100 panels per hour to help expedite the inner layer treatment process. Compared to the previous process of manual dip tanks, the Oxide Replacement line is far more efficient due to automation. By using fewer heaters, the new unit is more energy efficient as well.
Industry News | 2013-09-24 14:26:38.0
Engineered Material Systems debuts its CA-102 Conductive Adhesive designed for bonding components to circuit boards.
Industry News | 2012-04-27 19:07:14.0
Advances in power electronics are key to a sustainable energy future: Semiconductor power devices such as insulated gate bipolar transistors (IGBTs) deliver the high switching speeds which are critical for energy efficiency in electric cars, trains and other industrial applications. For the use of alternative energies, ultra-high efficiency and high-power density designs are imperative. Recognizing these market needs, Henkel has developed a comprehensive range of materials to further advance power electronics technology and will showcase these innovations from 8 to 10 May at SMT in Nuremberg.
Industry News | 2013-12-18 15:18:53.0
Isola Group had successfully transitioned the manufacturing of its low-loss, I-Speed material to Asia. The move was in response to an increased demand for I-Speed products. The cost benefits of manufacturing in Asia have enabled a price reduction of I-Speed for printed circuit board (PCB) fabricators located in the Asia-Pacific region.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
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