Industry News: mil spec soldering acceptance (Page 1 of 5)

Essential PCB Design Rules

Industry News | 2018-10-18 11:20:59.0

Essential PCB Design Rules

Flason Electronic Co.,limited

IPC Document Reaches Four New Corners of the World

Industry News | 2003-02-07 08:40:55.0

The Industry's Most Invaluable Tool for Quality Assurance and Assembly Departments is Now Available in Japanese, German, Czech and Danish

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

New Hands On Class for Wire/Cable Assembly

Industry News | 2016-09-01 12:07:57.0

A new class has been developed to teach EMS providers and others the basics of wire harness assembly techniques. This class goes along with the popular IPC-A-620 Wire and Cable Harness Assembly Acceptance standards.

BEST Inc.

STI Electronics, Inc. Introduces Products and Services to Support Cable/Harness Assembly

Industry News | 2010-03-03 13:45:14.0

MADISON, AL — March 2010 — STI Electronics, Inc., a full service organization providing training, electronic and industrial distribution, consulting, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, introduces Cable Assembly Kits and Training to support customers involved in cable and harness assembly.

STI Electronics

Retronix Installs Hentec/RPS Lead Tinning Machine in Scotland Facility

Industry News | 2021-05-04 13:53:27.0

Odyssey 1750 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

CIRCOR Aerospace Purchases Hentec/RPS 1325 Odyssey Lead Tinning System

Industry News | 2021-09-07 11:14:42.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Holt Integrated Circuits Finalizes Purchase of Hentec/RPS Odyssey 1325 Lead Tinning System

Industry News | 2022-03-07 16:53:18.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

CiRCLE Engineers Purchases Hentec/RPS 1325 Odyssey Lead Tinning System for Israel Facility

Industry News | 2021-10-18 12:49:19.0

Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities.

Hentec Industries, Inc. (RPS Automation)

Circuit Technology Center Partners with Hentec RPS to Provide World-Class Component Modification Services

Industry News | 2022-01-24 18:01:46.0

Available component modification services utilizing Hentec/RPS Odyssey RHSD systems include BGA de-balling, gold mitigation, lead tinning and tin whisker mitigation.

Hentec Industries, Inc. (RPS Automation)

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