Industry News | 2007-10-29 22:33:48.0
Agilent Technologies Inc. (NYSE: A) today announced the industry's first probing solution for making oscilloscope measurements in environmental chambers and in other settings with extreme temperature conditions.
Industry News | 2016-03-14 12:09:43.0
A better choice in thermal-forcing technology for Semiconductors IC Testing, Characterization, Validation, Reliability, FA, ATE and Production.
Industry News | 2021-09-27 11:34:09.0
Ganged Female Socket Snap-In Connectors are designed for Rugged Applications in a Compact Space
Industry News | 2007-11-27 12:28:45.0
FINEPLACER� FEMTO, introduced in beginning of 2007, is now optimized for one of the most sophisticated bonding application. Due to the high process flexibility the FEMTO can handle both laser bar processes AuSn and Indium.
Industry News | 2012-10-26 11:31:20.0
: Data I/O Corporation (NASDAQ:DAIO), announces the election of Anthony Ambrose as President effective today, and as Chief Executive Officer effective November 14, 2012.
Industry News | 2010-03-30 16:02:24.0
HOUSTON - BPM Microsystems, in conjunction with its distributor Adaptsys, announces that Lewmax Programming Ltd., a leading global provider of device programming and other value-added services, has chosen the 4610 automated production programmer to accommodate its increasing programming demands. The machine is expected to increase production output by 10 million programmed parts per year.
Industry News | 2021-08-10 11:34:30.0
New CIT Relay & Switch Anti-Vandal Switches with Multiple Mounting Options is available in Four Sizes, Three Voltage Ranges
Industry News | 2016-05-13 11:56:03.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
Industry News | 2016-05-13 12:00:12.0
The process of manufacturing and qualifying IC's consists of many steps while Temperature forcing systems play a crucial role in the final testing process. These environmental tests assure quality and reliability by stressing the device on one hand as well as helping to characterize and validate it on the other hand (making sure manufacturing outcome meets the design requirements). At later stages the temperature testing can support failure analysis effort and root cause analysis. AS common practice we are dealing with few different kinds of temperature forcing systems: Chambers, Thermal Stream systems and Direct Thermal Head systems. In this article I would like to focus on the practical aspects of utilizing Thermal Stream systems and Direct Thermal Head systems.
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