Industry News | 2003-05-19 10:06:43.0
The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2018-10-18 11:08:03.0
Different Techniques for Plating
Industry News | 2014-06-26 20:12:53.0
Isola Group announced the introduction of Tachyon-100G laminates and prepregs, which enable line cards required to transmit 100 Gigabit Ethernet (100GbE) at data rates in excess of 25 Gb/s per channel. Tachyon-100G has identical electrical properties as its predecessor Tachyon; however, the Z-axis coefficient of thermal expansion (CTE) on Tachyon-100G is more than 30% lower than Tachyon, making it more suitable for fabricating high-layer count, 0.8 mm pitch line cards with heavy 2 oz. copper inner layers.
Industry News | 2023-07-03 19:52:11.0
Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.
Industry News | 2015-08-11 13:31:16.0
“The ViTrox V810 system has proven to be quite capable in its intended mission, helping us produce defect-free product for IPC610, Class III customers in the Defense, Aerospace, Industrial Computing and Medical market sectors. The machine is very reliable and we really appreciate the outstanding support from the ViTrox team for training, upgrades and technical information.” Dane Wentworth, Senior Vice President, MPI
Industry News | 2016-07-02 06:50:18.0
Juki Automation Systems is pleased to announce that its ISM UltraFlex 3600 Intelligent Storage System provides automatic kitting for the next run on placement machines. Providing the ultimate flexibility, the system communicates with the placement system when a reel of parts is low.
Industry News | 2019-01-30 20:56:59.0
Kurtz Ersa today announced that it received two 2019 NPI Awards in the categories of Repair / Rework for the HR 600 XL, and Soldering – Selective for the VERSAFLOW 4XL. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
Industry News | 2014-06-05 12:21:18.0
AI Technology introduces COOL-GUMPAD™ CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.
