Industry News | 2025-09-15 11:21:44.0
SHENMAO TECHNOLOGY is pleased to introduce SMF-WC58, a water-soluble, halogen-free tacky flux developed for ultra-fine bump pitch flip-chip and BGA/CSP attach processes.
Industry News | 2025-05-06 20:54:46.0
SHENMAO America, Inc. is proud to highlight the benefits of its PF606-PW220 lead-free water-soluble solder paste. This innovative material is designed to meet the growing demand for reliable, easily cleanable soldering solutions in high-reliability PCBA (Printed Circuit Board Assembly) applications.
Industry News | 2022-10-11 17:22:18.0
SHENMAO America, Inc. has successfully developed a no-clean high thermal impact reliability solder paste. PF918-PW216 solder paste adopts the newly designed high reliability lead-free alloy (Sn/4Ag/3Bi) that achieves tensile strength performance 1.4 times higher than typical SAC305 alloys.
Industry News | 2023-01-30 16:07:57.0
SHENMAO America, Inc. received a 2023 NPI Award in the category of Soldering Materials for its PF918-PW216 water-soluble high thermal impact reliability solder paste. The award was announced during a ceremony that took place Monday, Jan. 23, 2023 in San Diego.
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