Industry News: oriented (Page 1 of 48)

Cable Jumpers Provide Flexible Connections

Industry News | 2003-05-02 08:01:53.0

Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.

SMTnet

Center for Electronics Manufacturing and Assembly Receives Automated Optical Inspection Equipment

Industry News | 2020-04-11 14:25:00.0

Increased capabilities in lab will support increased research and training opportunities in photonic

MIRTEC Corp

Sales and Result Improved: VOGT electronic on the Right Course

Industry News | 2003-05-29 08:30:31.0

Losses halved in the first half year � New organization of electronics group next on the agenda

SMTnet

The Future of Automated Optical Inspection

Industry News | 2021-09-02 06:10:22.0

MIRTEC announces the release of their comprehensive AI based Smart Factory Automation solution 'INTELLI-PRO'. This Technologically Advanced Software and Algorithm Package is specifically designed for the purpose of improving the performance and convenience of MIRTEC's complete line of AOI machines. INTELLI-PRO consists of a proprietary Deep Learning based Automatic Part Search and Teaching function, and AI based; Automatic Parameter Optimization, Character Recognition (OCR), Foreign Object Detection (FOD), Placement Inspection Algorithms and an Automatic Defect Type Classification function.

MIRTEC Corp

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Industry News | 2011-08-15 12:43:52.0

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces 7th International Wafer-Level Packaging Conference (IWLPC) Program

Industry News | 2010-06-28 16:44:36.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 7th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 11-14, 2010 at the Santa Clara Marriott Hotel in Santa Clara, California. Registration is now available on-line. Early Bird conference pricing is in effect until September 10, 2010, after which registration prices will go up $100.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2011-07-20 14:49:09.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California

Surface Mount Technology Association (SMTA)


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