Industry News: package warpage (Page 5 of 11)

Akrometrix Announces Automated Die Attach Tilt Metrology

Industry News | 2016-02-25 08:45:46.0

Akrometrix today announced that it has developed an automated die-board (or daughter-mother board) attach tilt metrology. All Akrometrix shadow moiré or DFP systems (AXPs) can be upgraded with the new feature.

Akrometrix

Akrometrix Announces Enhanced Digital Image Correlation (DIC) Module

Industry News | 2016-03-30 08:12:07.0

Akrometrix today introduced the latest generation Digital Image Correlation (DIC) module for both its AXP and PS200 platforms.

Akrometrix

Laserssel Co., LTD Introduces rLSR Mini LED Rework System

Industry News | 2021-07-02 04:06:41.0

Laserssel Co., LTD is pleased to introduce its rLSR Mini LED Rework System. The revolutionary soldering technique enables the industry to solder temperature sensitive, warpage prone, very fine-pitch, odd form, big die, SiP, wearables, flex to flex, and various other mainstream and niche applications defect-free, high yield and with a low cost of ownership.

Laserssel Corporation

Laserssel Wins TWO 2021 Mexico Technology Awards

Industry News | 2021-11-03 13:33:10.0

Laserssel Co., LTD is pleased to announce that it received two 2021 Mexico Technology Awards in the categories of Bonding Equipment for its LCB 3000 Laser Compression Bonder and Rework & Repair for its Laserssel rLSR Mini LED Rework System. The awards were announced during a ceremony that took place Wednesday, Nov. 3, 2021 during SMTA International in Minneapolis, MN.

Laserssel Corporation

Laserssel Appoints Kurt Whitlock Associates as Newest Rep

Industry News | 2019-08-20 16:43:50.0

Laserssel has announced their newest rep appointment of Mike Holleran of Kurt Whitlock Associates, who will cover all of Florida.

Laserssel Corporation

Laserssel Appoints SW Systems Technology

Industry News | 2019-08-20 16:46:07.0

Laserssel has announced SW Systems Technology as its representative for Southwest US and Mexico.

Laserssel Corporation

Laserssel to Highlight Advanced LSR Technology at SMTAI 2019

Industry News | 2019-09-04 14:40:11.0

Laserssel has announced they will exhibit in booth #1109 at SMTA International, scheduled to take place September 24-25, 2019 at the Donald Stephens Convention Center in Rosemont, IL.

Laserssel Corporation

Laserssel to Highlight Advanced LSR Technology at SMTA Guadalajara 2019

Industry News | 2019-09-23 16:15:55.0

Laserssel has today announced they will exhibit in booth #611 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 23-24, 2019 at the Expo Guadalajara in Guadalajara, Mexico.

Laserssel Corporation

Nihon Superior to Introduce TempSave duringAPEX 2021

Industry News | 2021-02-12 16:08:40.0

Nihon Superior Co. Ltd is pleased to announce thatit will exhibit its newly developed TempSave series during the 2021 IPC APEX Virtual EXPO, scheduled to take place March 9-11, 2021 online at www.ipcapexexpo.org. The company also will showcase its NozzleSave alloyalong with SN100CV P608 and LF-C2 P608 solder pastes.

Seika Machinery, Inc.

Nihon Superior to Highlight TempSave Soldering Materials and SN100CV P608 Paste at SMTAI

Industry News | 2021-10-07 15:29:25.0

Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.

Nihon Superior Co., Ltd.


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