Industry News: pcb and warpage and reduction (Page 1 of 6)

MIRTEC to Exhibit Its Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2016

Industry News | 2016-08-29 18:31:30.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier its award-winning 3D AOI and 3D SPI systems in Booth #707 at the 2016 SMTA International Exhibition. The exhibition will take place September 27-28, 2016 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corp

MIRTEC to Exhibit Their Award-Winning 3D AOI and 3D SPI Systems at SMTAI 2017

Industry News | 2017-08-14 19:06:07.0

MIRTEC, “The Global Leader in Inspection Technology,” will premier their award-winning 3D AOI and 3D SPI systems in Booth #606 at the 2017 SMTA International Exhibition. The exhibition will take place September 19-20, 2017 at the Donald Stephens Convention Center located in Rosemont, IL.

MIRTEC Corp

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

Nordson Electronics Solutions introduces new SELECT Synchro selective soldering system to increase throughput and flexibility while reducing footprint and cost-of-ownership

Industry News | 2022-12-07 07:48:52.0

With synchronous motion, the SELECT Synchro system boosts throughput 20-40% for most applications in a 60% smaller footprint

Nordson Electronics Solutions

Session 6 Agenda Is Finalized for the High-Rel Cleaning and Coating Conference Hosted by IPC and SMTA

Industry News | 2012-11-07 11:01:55.0

IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

MPM Announces New EdgeLoc Board Clamping and Board Staging Options for Edison Printers

Industry News | 2020-04-14 22:07:07.0

ITW EAE is announcing new features for the MPM® Edison™ Printer. Board staging, designed to meet the demands from Automotive manufacturers for reduced cycle time, will now be a feature on the Edison. And the new EdgeLoc™ II is a robust addition to the side-clamming capability on the Edison.

ITW EAE

World’s Premier Electronics Manufacturing Technical Conference Selects Best International and U.S. Papers Papers to be Presented at IPC APEX EXPO 2012

Industry News | 2012-02-23 14:43:13.0

IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

SHENMAO to exhibit new pastes at SMTAI SHENMAO pastes reduce peak reflow temperature, energy consumption, and warpage of PCBs and components

Industry News | 2018-09-18 20:19:23.0

SHENMAO America, Inc. is pleased to announce plans to exhibit in booth 233 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon. During the two-day expo, the company will showcase its PQ10 low-temperature solder paste and PF606-P245 new generation lead-free zero halogen solder paste.

Shenmao Technology Inc.

Akrometrix to Participate in the SMTAI Spotlight 5 Panel Discussion: “Warpage Induced Defects and Component Warpage Limits”

Industry News | 2017-08-30 16:58:11.0

Akrometrix will be a panelist in the upcoming SMTAI Spotlight 5 panel discussion, scheduled to take place Wednesday, Sept. 10, 2017 from 2-3 p.m. The discussion, entitled “Warpage Induced Defects and Component Warpage Limits,” will be streamed on Facebook Live.

Akrometrix

Indium Corporation to Host PCB and Component Defects Webinar

Industry News | 2020-08-22 04:07:55.0

Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).

Indium Corporation

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Precision PCB Services, Inc
Precision PCB Services, Inc

Products, services, training & consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep, Distributor & Service Provider for Seamark/Zhuomao and Shuttle Star BGA Rework Stations.

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