Industry News: phoenix and package and analyzer (Page 3 of 6)

This in-person event will bring together operations, maintenance, engineering, and technology leaders to connect and learn about the industry's latest innovations and solutions

Industry News | 2022-04-20 14:38:49.0

Rockwell Automation, Inc. announced today that registration is now open for ROKLive, a Rockwell Automation and Plex Systems event taking place June 13-16 in Orlando, Fla. Joining with newly acquired Plex's annual PowerPlex event, the in-person ROKLive experience will bring together operations, maintenance, engineering and technology leaders and innovators to explore how Rockwell Automation's enterprise-wide solutions are linking OT and IT like never before.

Rockwell Automation, Inc.

University of Maryland professor, renowned author and editor dr. Michael Pecht to address 2008 International Reliability Physics Symposium.

Industry News | 2008-04-22 20:28:50.0

The IEEE International Reliability Physics Symposium's (IRPS) 46th annual conference announces the keynote speaker of this year's event will be Dr. Michael Pecht, chair professor and the director of the Center for Advanced Life Cycle Engineering (CALCE) at the University of Maryland.

Institute of Electrical and Electronics Engineers (IEEE)

Saki Corporation Exhibits 3D AOI and SPI Systems at SMT Hybrid Packaging

Industry News | 2015-04-21 17:10:49.0

Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.

SAKI America

Nordson to Exhibit Full Range of Market Leading Test and Inspection Systems at SMT/Hybrid/Packaging 2016

Industry News | 2016-04-04 09:33:43.0

Nordson DAGE, MatriX Technologies and Nordson YESTECH, divisions of Nordson Corporation (NASDAQ: NDSN), will exhibit their range of market leading Test and Inspection systems in Hall 7A, Booth 329 at the forthcoming SMT/Hybrid/Packaging, scheduled to take place April 26-28, 2016 at the Messe in Nuremberg, Germany.

Nordson DAGE

DOCTAR Design Review Software Adds Printed Circuit Board (PCB) Test Point and Physical Component Change Analysis

Industry News | 2003-03-11 21:51:18.0

New release compares netlists to identify test points moved, added, deleted, renamed or re-assigned in Excel and HTML reports.

cadalist-enterprises

Indium Corporation's Technology Experts to Present at IPC Conference on Solder and Reliability

Industry News | 2013-11-08 17:55:20.0

Several Indium Corporation technology experts will present at the inaugural IPC Conference on Solder and Reliability November 13-14 in Costa Mesa, California.

Indium Corporation

Data I/O and Matthew Associates to Feature Industry Leading FlashPAK III and ProLine RoadRunner at SMTA Nutmeg Expo & Tech Forum

Industry News | 2010-11-15 22:12:10.0

Data I/O Corporation and Matthew Associates will showcase the FlashPak III and ProLINE-RoadRunner™ systems at the upcoming SMTA Nutmeg Expo & Tech Forum

Data I/O Corporation

New Pressurex Zero� Sensor Film Measures and Maps Very Low Contact Pressures

Industry News | 2008-11-06 10:05:03.0

Pressure-Indicating Sensor Film Useful in PCB Lamination and other Applications

Sensor Products Inc.

BTU and ECD Win the EM Asia Innovation Award for the New Recipe Pro

Industry News | 2016-04-29 12:15:21.0

BTU International announces that it has been awarded a 2016 EM Asia Innovation Award in the category of Software – Process Control for its RecipePro recipe generator software. The award was presented to the company during an April 27, 2016, ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. The new Recipe Pro recipe generator software was jointly developed with Electronic Controls Design Inc. (ECD).

BTU International

New Digital Hot Air Pencil and Solder Tip Cleaner at SMTA New England

Industry News | 2017-11-08 15:02:14.0

Metcal announces plans to exhibit at the SMTA New England Expo & Tech Forum, scheduled to take place Thursday, November 16, 2017 at the DCU Center in Worcester, MA. The company will show its Connection Validation (CV) Soldering System with new CV Monitoring Software, and its brand new HCT2-200 Digital Hot Air Pencil and AC-STC Solder Tip Cleaner.

Metcal


phoenix and package and analyzer searches for Companies, Equipment, Machines, Suppliers & Information