Industry News: pin dipping (Page 1 of 3)

Tens of Millions of Footprints & 3D Models for FREE

Industry News | 2017-05-11 17:06:16.0

Library Expert Lite automatically builds footprints and 3D STEP models for tens of millions of parts, for free.

PCB Libraries, Inc.

Nordson Electronics Solutions wins Global Technology award for the ASYMTEK Select Coat SL-1040 Conformal Coating System

Industry News | 2024-11-04 15:16:00.0

The SL-1040 pairs new process control and new maintenance features, ideal for conformal coating in high-volume electronics manufacturing

Nordson Electronics Solutions

How Conformal Coating Protects PCBs

Industry News | 2018-10-18 10:51:08.0

How Conformal Coating Protects PCBs

Flason Electronic Co.,limited

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

New Yorker Electronics Releases New Adam Tech Waterproof Discrete Pogo Pins

Industry News | 2020-12-10 14:18:13.0

IP Rated Spring-Loaded DIP Pins from Adam Tech Interconnects Prevent Moisture from Entering the Pin around Barrel Seams

New Yorker Electronics

SHENMAO Exhibits at IMAPS System in Package June 27-28, 2017 Introducing 3 New Semiconductor Packaging Fluxes

Industry News | 2017-06-25 20:33:39.0

SHENMAO Technology, Inc. introduces New Generation Ultra Tacky Flux SMF-WC52 applied in the Flip Chip dipping process. Its high tacky property keeps Chip in place during reflow for excellent soldering performance, while creating outstanding solder joint strength.

Shenmao Technology Inc.

Catalyst Semiconductor 128-Bit EEPROM Reduces PCB Area by 40 Percent

Industry News | 2003-04-29 08:44:42.0

New technology allows the CAT24C00 to be packaged in a compact, 5-pin SOT23 package that requires 40 percent less printed circuit board area than an MSOP package.

Catalyst Semiconductor

Improved Dip Soldering Systems Have Wider Range of Capability

Industry News | 2014-05-16 14:31:53.0

While dip soldering of through-hole components has long been an easy and affordable way to automate manual soldering processes when the costs of wave soldering cannot be justified, these latest enhancements increase quality and repeatability to a degree that make Auto-Dip systems ideal for virtually any short-run, batch application.

Manncorp

SHENMAO Offers Enhanced Solder Joint Encapsulation Material Flux

Industry News | 2022-06-24 10:13:15.0

SHENMAO America, Inc. is pleased to offer its enhanced Solder Joint Encapsulation Material (SJEM) SMEF-Z52 Flux. The SJEM Flux combines the abilities of conventional flux and underfill. The epoxy cures after reflow and provides excellent bonding strength and joint protection. Joint reliability performance is elevated as well.

Shenmao Technology Inc.

NEW ARIES SHORTFORM CATALOG COVERS PIN BALL BGA

Industry News | 2004-11-10 18:04:10.0

Frenchtown, NJ, November 2004

Aries Electronics Inc

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