Industry News: profile qsv1 plus (Page 7 of 7)

TAKAYA Launches APT-1600FD-SL, Dual-Sided Flying Probe Tester with Big Board Handling Capability, Advanced Features

Industry News | 2021-06-30 04:21:06.0

Takaya's APT-1600FD-SL Dual Sided Flying Probe test system for assembled PCBAs delivers both high speed and a larger testing area designed to accommodate large PCBAs for the emerging markets of 5G communications and BMS (Battery Management System) applications. The "-SL" series provides a 48% larger test area, which aligns perfectly with applications including semi conductor test probe card manufacturers. These customers urged Takaya to increase the test area of their dual-sided system.

Texmac, Inc.

Koh Young Returns to Semicon West with New Inspection Solutions Designed for Semiconductor and Advanced Packaging Challenges

Industry News | 2023-06-12 20:40:57.0

Atlanta, GA – Koh Young, the industry leader in True3D™ measurement-based inspection solutions, is pleased to announce its return to SEMICON West with a new series of inspection solutions designed to increase advanced package and semiconductor yield. Several of our latest inspection machines will be on display during SEMCION West in booth 329 from 11-13 July 2023 in the Moscone Center, San Francisco, CA.

Koh Young America, Inc.

Fast Double-Sided Inspection from Viscom at productronica 2023

Industry News | 2023-10-23 10:03:02.0

At productronica in Munich, Germany, taking place from November 14 to 17, 2023, Viscom AG will present for the first time its latest high-end iS6059 Double-Sided Inspection system. At Viscom's Booth A2.177, visitors to the world's leading trade fair for electronics manufacturing can learn more about the advantages of simultaneous optical assembly inspection from above and below using the new machine's special features.

Viscom AG

GiveMePower Corporation In Final Beta Testing For New PowerCAD� SiteMaster� 2 Mobile and Wireless Building Surveying Solution

Industry News | 2005-09-15 12:19:34.0

More than 100 companies, government enterprises and educational institutions contributing to public release of �revolutionary� laser-based building surveying and facilities management solution

GiveMePower Corp.

ADLINK Employs Latest Intel® Atom™ and Intel® Celeron® SoC for High Performance, Low Power Designs From SMARC Modules to Rugged Systems

Industry News | 2014-03-20 10:03:43.0

ADLINK Technology announced an array of new products in various form factors based on the latest Intel® Atom™ and Celeron® processors for intelligent systems, featuring a significant performance per watt improvement over previous generations, high integration of both low speed and high speed IO’s, an advanced graphics engine, and virtualization support - all on a sub-10-watt system-on-chip (SoC) that enables small, light, and reliable embedded designs.

ADLINK Technology, Inc.

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