Industry News | 2003-03-25 09:24:51.0
The Cadstar Universal package enables educational establishments to provide multiple licences of current generation PCB design solutions for students at a cost equivalent to a standard single licence.
Industry News | 2020-04-11 14:25:00.0
Increased capabilities in lab will support increased research and training opportunities in photonic
Industry News | 2003-03-04 08:31:59.0
Ian Suttie To Drive Company's Expansion in Professional Printed Circuit Board Design Market
Industry News | 2011-08-18 14:41:06.0
MIRTEC, “The Global Leader in Inspection Technology,” announced that it will exhibit its award winning MV-3L Desktop AOI machine at the upcoming SMTA Capital Expo & Tech Forum.
Industry News | 2003-03-19 08:25:45.0
Pilot Program Facilitates Information Exchange Standards in Electronics Manufacturing Industry
Industry News | 2003-02-04 08:49:40.0
John Was the Product Manager for Orcad's Schematic Capture and PCB Layout Programs from 1994 to 2001
Industry News | 2003-07-09 09:00:46.0
He will have responsibility for all aspects of Photronics� manufacturing and sales activities in China, Singapore and Taiwan.
Industry News | 2003-05-22 08:54:17.0
Allows PCA Manufacturers to Compare Costs of Alternative Test Strategies
Industry News | 2008-07-19 15:43:12.0
MINNEAPOLIS, MN � SMTA and CALCE @ University of Maryland are pleased to announce the technical program of the 2nd Annual Symposium on Avoiding, Detecting, and Preventing Counterfeit Electronic Parts is now available for viewing. The symposium will be held on September 9-10, 2008 at the University of Maryland, College Park, MD.
Industry News | 2009-07-24 14:13:44.0
Minneapolis, MN – The SMTA and MEPTEC are proud to announce the program for their co-organized 2009 Medical Electronics Symposium: Drivers for Technology, Health and the Economy on September 16-17, 2009 at Arizona State University, Tempe, AZ. This two day program will cover a broad spectrum of medical applications with Day 1 focusing primarily on the chip level component packaging and Day 2 focusing on board assembly and systems levels.
