Industry News | 2021-02-12 16:52:12.0
Virtual Industries Inc. offers the STEALTH-VAC™ ELITE ESD-SAFE Kit – Normally Closed VACUUM PEN™ (Order #VVSV-NC-KIT). The system operates on compressed air or nitrogen.
Industry News | 2009-09-17 14:28:17.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman, CTO, along with co-author Mike Konrad, President of Aqueous Technologies, will hold a presentation titled “Cleaning for Reliability Post QFN Rework” at the upcoming SMTA International conference, scheduled to take place October 6-7, 2009 at The Town and Country Resort and Convention Center in San Diego.
Industry News | 2021-08-25 16:20:31.0
Two additional Hentec/RPS Odyssey 1325 RHSD machines will expand high reliability BGA alloy exchange and component re-finishing capabilities.
Industry News | 2009-11-02 21:59:00.0
GREELEY, CO —FCT Assembly premiers NL930, a lead-free, no-clean solder paste that features the company’s latest technology in print and reflow of paste in the no-clean category.
Industry News | 2010-04-10 23:59:50.0
LOS ALAMITOS, CA - Following the success of their 2007 test board and kit, Practical Components and Aim Solder have updated their offering with a new AIM print test board and kit that is designed to include many printing challenges commonly found in manufacturers' assemblies.
Industry News | 2010-01-13 19:55:42.0
SOUTH AYRSHIRE, SCOTLAND — January 2010 — Etek Europe, a leading supplier of products and services to the European electronics industry, announces that it now represents Den-On Instruments Co. Ltd.’s RD-500III series of Hot Air Rework Stations throughout Eastern Europe.
Industry News | 2018-10-18 10:24:05.0
The Design Principles of Stencil Apertures
Industry News | 2021-02-09 12:28:27.0
Odyssey 1325 provides high reliability BGA alloy exchange and component re-finishing capabilities
Industry News | 2009-09-08 06:41:40.0
NBS adds more new SMT Assembly Capacity
Industry News | 2011-01-11 13:37:34.0
Practical Components has added the Casio Micronics WLP Wafer Chip Size Package (WLP) to its comprehensive line of dummy components. The WLP is a miniature package, suitable for installation in surface mount technology (SMT).
