Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2014-10-06 17:27:56.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2014-11-03 19:13:50.0
Industry-leading associations IPC and SMTA jointly announce the High-Reliability Cleaning and Conformal Coating Conference scheduled to take place November 18-20, 2014 at the Chicago Marriott in Schaumburg, Illinois.
Industry News | 2010-11-15 22:46:09.0
Research conducted by IPC indicates the top ten technology trends to watch in electronics manufacturing. Free White Paper Reveals Industry Views on Critical Technologies
Industry News | 2018-10-18 10:02:00.0
How does PCB X-Ray Inspection Work?
Industry News | 2007-10-09 00:22:12.0
SEOUL, South Korea--(BUSINESS WIRE)--Oct. 8, 2007--PerkinElmer, Inc. (NYSE: PKI), a global leader in Health Sciences and Photonics, dramatically strengthens its portfolio of protein analysis and imaging technologies with the introduction of five new products at the Human Proteome Organization's (HUPO) 6th Annual World Congress in Seoul, South Korea, Oct. 6-10.
Industry News | 2001-06-26 09:50:17.0
The Mega™ II's revolutionary closed-loop, solvent (or water), electronic assembly and parts cleaning system with quantitative ION detection and statistical process control capability is ideal for Flip Chip, Optoelectronics, and advanced or high reliability technology packages and assemblies.
Industry News | 2012-09-17 14:50:33.0
Kyzenwill present “Under stencil wiping: Does it benefit your process?” at the upcoming SMTA International Conference and Expo,
Industry News | 2012-11-08 12:01:36.0
Kyzen, will present papers at SMTA Penang Tabletop Exhibition, scheduled to take place November 16, 2012 at the Eastin Hotel Penang, Malaysia.
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