Industry News | 2010-06-04 16:50:52.0
BANNOCKBURN, Ill., USA — IPC — Association Connecting Electronics Industries® today expressed disappointment in the vote by the European Parliament’s Environment Committee to include broad families of chemicals, such as organobromines, in Annex III for priority assessment. While an outright ban of these chemicals has been averted in this vote, the committee’s decision falls far short of supporting a rigorous scientific assessment that would ensure protection of the environment and human health.
Industry News | 2010-06-21 15:34:44.0
BANNOCKBURN, IL — IPC members put democracy to work as they participated in IPC’s Capitol Hill Day (CHD), June 9–10, 2010, in Washington, D.C. Representing the largest PCB manufacturers, EMS companies and industry suppliers in North America, IPC members visited 70 Congressional offices advocating support for legislation to strengthen the North American electronic interconnect industry.
Industry News | 2010-11-24 16:02:14.0
IPC submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding Section 1502 of the Dodd-Frank Wall Street Reform and Consumer Protection Act, Public Law 111-203, on the trade of conflict minerals.
Industry News | 2011-06-29 16:18:11.0
IPC recently submitted comments to the U.S. Securities and Exchange Commission (SEC) regarding the legal basis for a phase-in of the conflict minerals regulatory requirements.
Industry News | 2011-09-06 13:07:52.0
IPC and six IPC-member companies have agreed to participate in a pilot evaluation program to review and refine the Organization for Economic Cooperation and Development (OECD) due diligence guidance for conflict minerals.
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-02-10 16:04:21.0
Representing IPC, Mikel Williams, president and CEO of DDi Corp. and chairman of the IPC Government Relations Committee, testified on February 7 before the U.S. House of Representatives Committee on Foreign Affairs to underscore the importance of clear and appropriate U.S. export controls on printed circuit board (PCB) designs for sensitive military technologies. The Committee on Foreign Affairs held the hearing to consider industry perspectives on export control reform, including proposals now being contemplated by the U.S. Departments of State and Commerce.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2012-06-18 20:00:08.0
Count On Tools Incannounces that PB Swiss Tools now makes significant contributions to the initiative associations Swissmen and Swissmechanic.
Industry News | 2014-07-09 17:14:50.0
IPC — Association Connecting Electronics Industries®. Presenting data collected by IPC over the past two years, the report highlights North American electronics industry trends in on-shoring and domestic sourcing and includes new data on the business impact from companies that have actually engaged in some form of on-shoring.
