Industry News: reflow problems (Page 1 of 26)

SMT Soldering Equipment Reflow Tool for Industry 4.0 - Frost & Sullivan Award

Industry News | 2017-09-16 02:29:39.0

Heller Industries has been awarded the 2017 Global Frost & Sullivan Company of the Year Award for its surface mount technology (SMT) soldering equipment that enables Industry 4.0. - the automation and data exchange in manufacturing technologies.

Heller Industries Inc.

Integrated Test Corporation Partners with MIRTEC for Total Quality 3D AOI Solution

Industry News | 2020-05-18 13:26:01.0

MIRTEC is pleased to announce that Integrated Test Corporation, a leading fabricator of ATE probe and final test PCBs, has selected MIRTEC as their 3D AOI partner with the purchase of an MV-7U OMNI Large Format PCB 3D AOI Machine.

MIRTEC Corp

SMT Workshop Planning Precautions---KINGSUN

Industry News | 2023-08-29 07:36:15.0

"DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD" provides overall solutions for SMT equipment and 3C intelligent factories.

DONGGUAN KINGSUN AUTOMATION TECHNOLOGY CO.,LTD

Solder Paste and Solder Joint Automatic Inspection Experience at SMTA International

Industry News | 2015-07-06 10:34:12.0

The SMTA announces a new feature area that will debut during the SMTA International Electronics Exhibition: the “SMTA - NPL Solder Paste and Solder Joint Automatic Inspection Experience.” This special feature will take place during both days of the SMTA International Exhibition at the Donald Stephens Convention Center in Rosemont, Illinois on September 29 - 30, 2015.

Surface Mount Technology Association (SMTA)

I.C.T SMT Vacuum Reflow Oven Machine

Industry News | 2022-10-13 07:44:15.0

I.C.T SMT Vacuum Reflow Oven Machine helps you to solve the problem of High Solder Voids Rates

Dongguan Intercontinental Technology Co., Ltd.

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

FREE Soldering and Assembly Defects - Causes and Cures Webinar

Industry News | 2010-12-01 14:28:16.0

With hundreds of opportunities for problems to surface during the electronics manufacturing process, it is a credit to the manufacturing and engineering talent of the industry that planes fly, pacemakers keep hearts beating and phones are at the ready to provide Facebook updates or even make a call. To keep these dedicated professionals up-to-date on the latest causes and cures for assembly and solder defects, IPC and the U.K. National Physical Laboratory (NPL) have teamed up to sponsor a free webinar at 12:00 pm (noon) U.S. Central time on January 27, 2011 — a precursor to the hands-on, three-day Process Defects Clinic that will be held at IPC APEX EXPO in April.

Association Connecting Electronics Industries (IPC)

What is the LED Panel SMT Production Process?

Industry News | 2022-10-12 07:22:35.0

I.C.T As an SMT Factory Solution Partner, Mainly Provide Full SMT Line Machine. Including SMT Pick and Place Machine, PCB Reflow Oven, SMT Stencil Printer, PCB Wave Soldering Machine, PCB Handing Machine and SMT Peripheral Equipment for Global Customers.

Dongguan Intercontinental Technology Co., Ltd.

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

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