Industry News: rehm oven (Page 1 of 1)

What is a vacuum reflow oven ? What are the categories ?

Industry News | 2019-12-16 22:31:09.0

Vacuum reflow solder is refers to the vacuum eutectic oven, vacuum in vacuum environment for high quality welding products, in the welding process of zhongtong into reducing system (N2, formic acid, N2H2, H2), to protect the product and the solder is not oxidized, at the same time the product and solder oxide on the surface of the reaction, make weld surface quality improvement, reduced the rate of welding hollow.

Beijing Technology Company

Rehm Thermal Systems Visu2 software brings new Best-in-class capabilities to Solar Cell Metallization

Industry News | 2009-08-20 14:26:25.0

Rehm Thermal Systems recently announced the launch of an advanced new series of firing systems for solar cell metallization to complement their recently updated line of drying systems. The RFS and RFS-D Fast Firing Systems and the RDS 2100 and 3000 drying ovens feature Rehm’s Visu2 software which drives a range of advanced process features and thermal control to enable PV manufacturers to move their processes to an entirely new level of efficiency and yield.

Rehm Thermal Systems Korea Limited

Rehm Thermal Systems opens new Applications Center in Roswell, Ga.

Industry News | 2010-02-22 11:53:39.0

Rehm Thermal Systems has moved into a new Applications Center which will serve their North America marketplace. Located in the Atlanta suburb of Roswell, the new facility is designed to provide Rehm customers everything needed to characterize their convection and condensation reflow processes.

Rehm Thermal Systems Korea Limited

Enhanced reflow cooling technology introduced by Rehm Thermal Systems

Industry News | 2010-03-15 13:23:37.0

Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.

Rehm Thermal Systems Korea Limited

Rehm Thermal Systems drive energy efficiency to unlock cost-of-ownership advantage

Industry News | 2009-11-03 09:42:11.0

Rehm Thermal Systems has reduced the cost-of-ownership of the formation of reliable solder joints for customers around the world. Driven by a commitment to energy efficiency that characterises products such as the VisionXP reflow system, Rehm’s cost-of-ownership advantage is the direct result of low energy consumption values.

Rehm Thermal Systems Korea Limited

Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems

Industry News | 2009-03-19 16:28:02.0

Rehm Thermal Systems is delivering advanced thermal performance for manufacturers around the world with its Dual Lane Vision X Series convection soldering system. Enabling simultaneous lead-rich and lead-free reflow soldering in a single system, the technology is ideal for manufacturers looking to run parallel processes conveniently and cost-effectively.

Rehm Thermal Systems Korea Limited

Rehm Thermal Systems showcases new fast-firing and drying technologies at EUPVSEC 2009, Booth B5/45

Industry News | 2009-09-10 13:09:28.0

The team at Rehm Thermal Systems are preparing to showcase the company’s best-in-class capabilities for solar cell metallization at the 24th European Photovoltaic Solar Energy Conference & Exhibition. Being held from September 21st – 25th in Hamburg, Germany, EUPVSEC 2009 will introduce visitors to the thermal specialist’s recently updated line of fast-firing systems and drying ovens.

Rehm Thermal Systems Korea Limited

NEPCON China 2012 Attracts Numerous Leading Manufacturers

Industry News | 2012-02-15 19:34:02.0

April 25, 2012 will witness the opening of NEPCON China 2012 at Shanghai World Expo Exhibition & Convention Center. As the largest event for the electronics manufacturing and SMT industry across Asia, NEPCON China has become the weather vane for China’s industrial peers. Currently, 98% of booths for NEPCON China 2012 are sold out with almost all the world-leading SMT manufacturers and material suppliers scheduled to exhibit.

Reed Exhibitions - RX (Reed Exhibitions)

5th "Deep Dive" SMT Seminar

Industry News | 2010-04-29 08:33:15.0

SIPLACE CA combines die-bonding and SMT placement to meet current trends in packaging of integrated circuits

Siemens Process Industries and Drives

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