Industry News: reworking bga (Page 11 of 42)

Seamark Zhuomao show x-ray component counter in Nepcon China at April 24-26

Industry News | 2019-04-25 06:24:05.0

At April 24-26th, we are at Nepcon China in Shanghai show our newest BGA rework station and X-ray smd parts counter.

Seamark Zhuomao Photoeletric technology(Shenzhen)CO., ltd

Whitepaper Discusses Critical Process Steps for High-Reliability BGA Device Re-balling

Industry News | 2023-07-19 09:52:10.0

The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized process.

Circuit Technology Center, Inc.

PACE & Cumberland Electronics to Present BGA/Area Array Component Rework Workshops in Philadelphia & Baltimore in September

Industry News | 2019-08-29 21:58:20.0

PACE Worldwide and Cumberland Electronics have teamed up to host two separate Technical Workshops on "Non-Destructive BGA/Area Array Component Rework" on September 10th at ACI Technologies in Philadelphia PA, and on September 12th at the PACENTER Training Center in Elkridge MD.

PACE Worldwide

PDR to demo entry level and advanced rework stations for SMD / BGA / microBGA / CSP / LED applications at SMTAI

Industry News | 2018-09-18 20:27:42.0

PDR today announced plans to exhibit at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. The company will have the IR-C3 Chipmate Entry-Level SMD/BGA Rework Station and IR-E3 Evolution Series SMD/BGA IR Rework Station in Booth #527.

PDR-America

Rocket EMS Adds Large BGA Rework Capability with New AIR-VAC DRS27

Industry News | 2015-04-15 19:00:42.0

Rocket EMS today announced it has further enhanced its already impressive rework and special project capabilities with the purchase of the AIR-VAC DRS27 Large Format BGA Rework Station. The DRS27 provides Rocket EMS with unparalleled precision and flexibility for rework and assembly of BGAs, QFNs, CSPs, flip chips, PoP assemblies, 01005s and more.

Rocket EMS

Etek Europe appointed as UK and Irish distributor of PDR - Rework Systems.

Industry News | 2016-01-19 15:21:34.0

Etek Europe are proud to announce that they have been appointed as the UK and Irish distributor for PDR – IR Rework Systems.  This appointment extends their distribution coverage which currently includes Algeria, Bulgaria, Finland, Hungary, Norway, Poland, Qatar, Romania, Saudi Arabia, Sweden, Tunisia, Ukraine, and United Arab Emirates.

Etek Europe

Murray Percival Co. Brings Ersa's Award-Winning Rework to Acromag, Inc.

Industry News | 2021-05-04 11:27:33.0

The Murray Percival Company today announced the sale of a Kurtz Ersa HR-550 BGA Rework System to Acromag, Inc.

Murray Percival

New AT-GDP Series BGA Rework Station Provides the Latest Precision and Process Control

Industry News | 2009-09-23 21:53:53.0

Advanced Techniques US (ATCO)announces the development of an AT-GDP Series BGA Rework Station. Precise mechanics coupled with a comprehensive software package automates the device removal and installation processes. This model handles both leaded and lead-free applications consisting of components such as BGA’s, CSP’s, QFN’s, Flip Chips, and other SMD’s.

Advanced Techniques US Inc. (ATCO)

Metcal to Host Series of BGA Rework and Repair Seminars

Industry News | 2013-03-25 15:21:46.0

OK International’s Metcal brand today announced the schedule for its 2013 Spring series of BGA rework and repair seminars.

OK International

Flextac Self-Adhesive Stencils Simplify BGA Rework

Industry News | 2001-02-26 11:18:45.0

Innovative Flextac Stencils simplify BGA rework. These self-sticking laser cut, polymer solder paste stencils use a residue-free adhesive similar to Post-it Notes to seal around BGA pads to ensure that solder paste will not bleed under the stencil when the paste is applied. Disposable Flextac Stencils are easy to use and will not leave any residue on the board surface.

Circuit Technology Center, Inc.


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