Industry News | 2013-03-29 11:40:39.0
CyberOptics Corporation (Nasdaq: CYBE) will preview the world’s most advanced SPI software in its representative HumanTek’s booth E-125 in Hall C at SMT/PCB & NEPCON Korea
Industry News | 2024-03-18 11:53:13.0
Inovaxe is gearing up for a strong presence at the upcoming 2024 IPC APEX EXPO. The company is poised to showcase its cutting-edge product lineup, promising to redefine inventory management and enhance production efficiency in Booth 1808. The 2024 IPC APEX EXPO is scheduled to take place April 9-11, 2024 at the Anaheim Convention Center in California.
Industry News | 2011-04-07 12:47:23.0
Panasonic Factory Solutions Company of America introduces the RL132 Radial Insertion Machine offering generation-ahead technologies in a spatially-efficient footprint.
Industry News | 2019-12-16 22:07:54.0
UVLED curing machine is generally used for UV glue, UV ink and other UV coating curing, can achieve the purpose of rapid deep curing, the principle is UV irradiation special glue causes glue to produce polymerization reaction to cure.
Industry News | 2016-05-16 20:59:04.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-07-02 06:40:16.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.75, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 8 worldwide SHENMAO locations.
Industry News | 2016-08-23 16:30:00.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, MBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity. Various diameters (0.76, 0.6, 0.5, 0.45, 0.3, 0.25, 0.1, 0.08, 0.07, 0.06 and 0.05 mm Dia.) are available at affordable low cost from 11 worldwide SHENMAO Technology locations.
Industry News | 2013-09-09 12:42:47.0
LTX-Credence Corporation (Nasdaq:LTXC), announced an important step in the evolution of the semiconductor test cell with an agreement to acquire Multitest and Everett Charles Technologies (ECT) from Dover Corporation (NYSE:DOV).
Industry News | 2013-09-12 14:15:54.0
CyberOptics Corporation (Nasdaq: CYBE) will present its award-winning SPI and AOI inspection solutions in booth #114 at the upcoming SMTA International Exhibition, scheduled to take place October 15-16, 2013 at the Fort Worth Convention Center in Texas.
Industry News | 2016-05-16 16:16:21.0
SHENMAO BGA Solder Spheres for PBGA, CBGA, TBGA, CSP and Flip Chip Assemblies are made by UMT (Ultra Micron Technology) from highly pure metals produced to various exact Alloy compositions using Piezoelectric Droplet Jet Technology in high volumes to accurate diameter uniformity, bright shiny surface finishes and high quality sphericity.
