Industry News | 2016-04-22 14:45:12.0
Indium Corporation has hired Andreas Karch as Regional Technical Manager, Germany, Austria and Switzerland.
Industry News | 2007-11-01 20:33:22.0
ITASCA, IL � November 1, 2007 � Kester announces it will launch the new EnviroMark 919G (EM919G) lead-free solder paste in Hall A4, Stand 363 at the upcoming Productronica 2007 exhibition and conference, scheduled to take place November 13-16, 2007 at the Munich Trade Fair Center in Munich, Germany.
Industry News | 2017-04-11 21:40:30.0
Kurtz Ersa North America is pleased to announce that it will exhibit with Comtree at EPTECH Markham, scheduled to take place Thursday, April 27, 2017 at Le Parc in Ontario. Comtree, Ersa’s exclusive representative in Canada, will demonstrate some of its rework award-winning systems, including the HR 550 hybrid rework system and the Smartflow 2020 selective solder system.
Industry News | 2016-08-03 20:06:03.0
Indium Corporation's new reclaim and recycle program is now offering customers credit for their solder pot dross and contaminated solder.
Industry News | 2019-01-16 09:48:30.0
Nordson DIMA will exhibit its C-TurnFlux system, the automated stand-alone hot bar system that combines flux dispensing with hot bar reflow soldering, at the IPC APEX Expo, San Diego, CA - its first live demonstration in North America. The C-TurnFlux combines both high output and quality, using high-speed product handling and guaranteed position repeatability for mission-critical assembly applications.
Industry News | 2021-10-07 15:29:25.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #3301 at the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. The company also will showcase SN100CV P608 solder paste.
Industry News | 2011-04-22 21:59:42.0
Vitronics Soltec USA will transition production of the XPM Reflow product line to its sister company’s location in Camdenton, Missouri, and will move production of Selective machinery to Vitronics Soltec's European manufacturing facility in Oosterhout, the Netherlands. The company will complete this transition by August 1, 2011.
Industry News | 2016-07-07 14:47:47.0
SHENMAO Bumping Solder Paste PF608-PI-21 (Sn/Ag4.0/Cu0.5/x) and PF606-P-BS1 (Sn/Ag3.0/Cu0.5/x) aim to decrease voids in wafer bumping process. SHENMAO MICRO MATERIAL INSTITUTE applications engineers focused on developing the Bumping Solder Paste Formula with excellent stencil printing transfer rate and the lowest Void to optimize manufacturing process performance. The world’s largest IC Packaging and Test Service OSAT utilize SHENMAO Bumping Solder Paste in production.
Industry News | 2014-05-06 10:43:05.0
Indium Corporation's Ed Briggs, senior technical support engineer, will present at the International Conference on Soldering and Reliability Wednesday, May 14 in Toronto, Canada.
Industry News | 2011-12-30 23:26:12.0
Nihon Superior has highlighted the effectiveness of Cu and Ni as the essential elements in forming a stable IMC layer in lead-free soldering.
