Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.
Industry News | 2016-03-30 09:04:09.0
Adding functional capability to its award-winning Technomelt® hot melt encapsulants, Henkel Adhesive Technologies today announced another formulation milestone with the development of a thermally conductive Technomelt material. With the ability to transfer heat through the encapsulating layer, thermally conductive Technomelt products offer dual-function performance in a single material solution.
Industry News | 2010-11-08 21:18:56.0
Techcon Systems introduces its new Rigid TT Series Dispensing Tips. The new rigid tips are designed to provide accurate positioning for automation dispensing applications.
Industry News | 2020-01-16 16:33:29.0
Techcon plans to exhibit in Booth #2247 at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. The company will showcase its new TS9800 Series Jet Valve Dispensing System in the Metcal booth.
Industry News | 2013-03-21 11:24:52.0
Techcon Systems, will demonstrate the newly released TS9000 Series Jet Tech valve in Booth # 9-517 at the SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2018-10-18 08:39:14.0
Stencil Technology for SMT production
Industry News | 2008-12-15 14:16:12.0
Garden Grove, CA � December 2008 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, introduces its new TS7000 Interchangeable Material Path (IMP) Series Rotary valve.
Industry News | 2009-01-19 00:55:12.0
Garden Grove, CA � January 2009 � Techcon Systems, a product group of OK International and a leading provider of fluid dispensing systems and products, announces that it will premier the TS7000 Interchangeable Material Path (IMP) Series Rotary valve in booth 1288 at the upcoming MD&M 2009 West exhibition & conference, scheduled to take place February 10-12, 2009 in Anaheim, Calif.
Industry News | 2018-09-18 20:14:13.0
Seika Machinery today announced plans to exhibit in Booth #307 at SMTA International, scheduled to take place Oct. 16-17, 2018 at the Donald Stephens Convention Center in Rosemont, IL. Seika will showcase a complete line up of leading-edge equipment, including the latest models from McDry, Unitech, Sayaka and MALCOM.
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