Industry News: sn63pb37 extremely low temperature (Page 16 of 20)

Eliminating Latency in Next Gen WiFi 6E Devices

Industry News | 2020-11-04 09:13:07.0

Advanced High-Q RF components will play a critical role in larger goal of eliminating many of the latency issues of the past

Johanson technology

ADLINK and Saguna Bring to Market a Mobile Edge Computing (MEC) Solution for Extreme Outdoor Environments

Industry News | 2016-02-02 09:20:10.0

ADLINK Technology announced today a joint Mobile Edge Computing (MEC) solution designed for deployments in harsh outdoor environments. As MEC gains momentum, and new trials and live deployments are underway, the need for robust, no-fault equipment increases. Bringing the Internet closer to users and the things of the IoT requires MEC platforms to be deployed at the edge of the Radio Access Network (RAN), which is often in harsh outdoor environments.

ADLINK Technology, Inc.

Henkel Launches High-Lead and Lead-Free Capable Die Attach Solder Paste for Enhanced Thermal Control of Power Devices

Industry News | 2009-07-24 13:38:04.0

To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.

Henkel Electronic Materials

ADLINK Introduces MXE-5500 Series of Powerful Fanless Embedded Computers with 6th Gen Intel® Core™ Processors

Industry News | 2016-07-07 13:38:30.0

ADLINK Technology announced the release of its new Matrix MXE-5500 Series, featuring 6th generation Intel® Core™ i7/i5/i3 processors (code name Skylake), and delivering outstanding performance with robust construction, rich I/O, and easy device access, all in a compact package.

ADLINK Technology, Inc.

ADLINK Technology to Showcase Latest Updates/Products on PXI Solutions

Industry News | 2014-04-01 20:16:29.0

ADLINKs presentation topic this year - Improving Signal Fidelity with FPGA Signal Averaging on PXI Module.

ADLINK Technology, Inc.

Press preview for ADLINK Technology for Embedded World, Hall A1.540, Nuremberg, February 27th- 1st March, 2018

Industry News | 2018-01-28 20:16:45.0

ADLINK Technology is leading edge computing with products and platforms that enable computing at the edge of the network, whether that network be the public Internet or an enterprise information technology (IT)/operational technology (OT) network. With the main goal of driving data-to-decisions, ADLINK provides solutions to connect the unconnected and simplify the design, development and deployment of Industrial Internet of Things (IIoT) applications.

ADLINK Technology, Inc.

SpacePC� 1451/1453 from Parvus to Integrate Fanless 400MHz Celeron CPU with Intel� Chipset and Gigabit Ethernet Controller or 6 Fast USB 2.0 Ports

Industry News | 2005-02-08 15:05:16.0

Parvus to release two new rugged embedded PC/104-Plus computers designed for high-speed networking, data transfer, and bandwidth-intensive applications

Parvus Corporation

ADLINK Announces Compact COM Express® Type 6 Module Featuring High Performance and Ultra-Low Power Consumption

Industry News | 2014-02-20 20:04:17.0

Embedded systems in the areas of medical, digital signage, gaming, video conferencing and industrial automation need outstanding CPU and graphics performance but are constrained by either size or thermal management. ADLINK Technology's new offering, the cExpress-HL COM Express® Type 6 Compact size computer-on-module (COM), takes full advantage of the Mobile 4th Generation Intel® Core™ Processor (formerly known as "Haswell-ULT") to provide a compact, high-performance COM solution with outstanding graphics capabilities.

ADLINK Technology, Inc.

Innodisk Debuting All-Flash Storage Appliance at Computex 2014

Industry News | 2014-05-28 05:49:28.0

Expanding Embedded Storage Lineup and Launching Enterprise Storage Line

Innodisk Corporation

New Yorker Electronics Releases Supercapacitor with High Voltage and High Energy Density

Industry News | 2020-12-23 19:03:03.0

Cornell Dubilier 3- and 6-volt Capacitors Offer Greater Power and Energy Density than Typical 2.7Vdc Parts

New Yorker Electronics


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