Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2019-05-20 18:57:09.0
SMTA recently released the Guide to BGA Assembly & Soldering Defects, a complimentary resource for the electronics manufacturing industry. The book was written by Keith Bryant, industry veteran and Chairman of the SMTA Europe Chapter, and reviewed by members of the SMTA Europe Technical Committee.
Industry News | 2020-06-24 15:45:07.0
IPC and High Density Package Users Group (HDP) have signed a Memorandum of Understanding (MoU), enabling a strengthened partnership, increased technical collaboration between groups, and providing a mutual path toward emerging and disruptive high density interconnect (HDI) technologies.
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2011-02-14 16:05:28.0
Design engineers using 0.8mm pitch 96 position BGA ICs will be interested in the PA-BGA96C-Z-01 probing and prototyping adapter with GHz BGA socket from Ironwood Electronics. Ironwood Electronics recently introduced a new BGA socket addressing high performance requirements for testing clock driver IC's. The socket is constructed with high performance and low inductance elastomer contactor.
Industry News | 2020-11-14 08:21:00.0
Our webinars for 2021 have now been launched with the first three dates for January, February and March available to book online. In addition our growing library of online archive video recordings are ready to provide support and education world wide from our website bobwillis.co.uk Solder Wicking Defects - Benefits, Causes & Cures 11th Jan at 2.30pm UK Time Solder Ball Elimination – In Wave, Selective & Reflow - Webinar 8th Feb at 2.30pm UK Time Dendrite & Corrosion Failure on PCBs – Causes & Cures - Webinar 8th March at 2.30pm UK Time
Industry News | 2019-08-19 15:02:03.0
YINCAE has successfully developed a new No Clean Flux product -NC 256 with zero flux residue, excellent soldering wetting and eliminates the cleaning process. NC 256 has been designed not only for wafer ball bumping and other ball bumping such as CSP, BGA, Flip chip and PoP (package on package), particularly for lead free applications, but also for flip chip, CSP, BGA and other advanced components attachment to eliminate cleaning process.
Industry News | 2011-02-26 14:35:16.0
Ironwood Electronics has recently introduced a new high performance WLCSP socket for 0.5mm pitch 40 ball WLCSP and 0.4mm pitch 30 ball WLCSP accommodated in the same socket.
Industry News | 2020-05-12 11:44:16.0
Thermaltronics USA, Inc. announces that it has added a new product to its solder robot range: the TMT-R8000S. The system simplifies and automates hand soldering processes with precision ball screws, servo motors and industry-leading software.
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