Industry News | 2018-10-18 09:34:29.0
Application of lead-free solder
Industry News | 2014-06-17 21:50:29.0
SMT International has just introduced AMTECH VS-213 (a.k.a. the VOIDSTOPPER), a no-clean, lead-free solder paste formula that is 100% halogen-free based on all testing methods, including Oxygen Bomb Combustion and Ion Chromatography.
Industry News | 2012-04-09 13:45:59.0
As the electronics assembly industry evolves, printed circuit board (PCB) features and surface mount technology (SMT) components continue to get smaller and smaller. This miniaturization shrinks the process window at print, placement, and reflow, increasing the opportunities for defects.
Industry News | 2022-02-25 13:35:22.0
Transition Automation today releases an updated holder design to improve blade support and simplify maintenance and blade changes for SMT printer operators. This new revision increases the holder width supporting the blade, which eliminates the support shim normally included with the holder assembly. This change also allows for faster printing speeds and better blade wiping as well as eliminating the problem of solder paste becoming lodged between the shim and blade after long use. An additional upgrade is the change to alloy steel flat head screws (vs. stainless steel). Alloy steel screws are less prone to stripping and deformation, making it easier to replace blades.
Industry News | 2022-02-25 13:35:37.0
Transition Automation today releases an updated holder design to improve blade support and simplify maintenance and blade changes for SMT printer operators. This new revision increases the holder width supporting the blade, which eliminates the support shim normally included with the holder assembly. This change also allows for faster printing speeds and better blade wiping as well as eliminating the problem of solder paste becoming lodged between the shim and blade after long use. An additional upgrade is the change to alloy steel flat head screws (vs. stainless steel). Alloy steel screws are less prone to stripping and deformation, making it easier to replace blades.
Industry News | 2012-09-17 15:38:30.0
SEHO North America, Inc. announces that Christian Ott, Senior Sales and Project Manager, will present a paper titled “Reduction of Voids in Solder Joints …
Industry News | 2018-01-24 20:47:58.0
SHENMAO America today announced plans to exhibit in Booth #2344 at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. The company’s new PF606-P140 / PF606-P245 Lead-free Zero Halogen Solder Pastes can eliminate Head-in-pillow (HiP) defects, voids, slumping, non-wetting opens and short stencil life.
Industry News | 2010-08-11 13:53:08.0
Stencil-cleaning is no longer just a maintenance function!
Industry News | 2001-08-02 16:39:57.0
Mr. Ray Chartrand, one of the leading experts in the Soldering Industry, in concert with ECD will be holding a series of cost-saving Profiling Seminar during August 2001. Ray has over 20 years experience troubleshooting soldering, reflow, and cleaning problems for the electronics industry and presently consults for over 40 of the largest industries in the electronic assembly marketplace.
Industry News | 2020-08-22 04:07:55.0
Indium Corporation will host an InSIDER Series webinar on causes and solutions of PCB and component warpage defects, presented by industry consultant Bob Willis. There will be two sessions on Wednesday, Sept. 9--5:30 a.m. Eastern Time (10:30 a.m. London Time, 5:30 p.m. Malaysia Time) and Noon Eastern Time (5 p.m. London Time, Midnight Malaysia Time).
