Industry News: soldering problems with qfn (Page 1 of 8)

Solve your semiconductor packaging problems with Nordson ELECTRONICS SOLUTIONS at SEMICON Taiwan 2020

Industry News | 2020-09-17 12:23:10.0

Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716

ASYMTEK Products | Nordson Electronics Solutions

Working with QFNs and QFPs

Industry News | 2018-10-18 09:05:06.0

Working with QFNs and QFPs

Flason Electronic Co.,limited

Panelizing PCBs with Tab Routing

Industry News | 2018-10-18 10:49:25.0

Panelizing PCBs with Tab Routing

Flason Electronic Co.,limited

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:18.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)

Preventing the Big 7 Mistakes of SMT Electronics Assembly with Expert Phil Zarrow

Industry News | 2016-10-20 19:39:17.0

The Philadelphia branch of the Surface Mount Technology Association (SMTA Philly) is kicking things off with a meeting on Thursday, November 10, 2016 at 3 p.m. at the Crowne Plaza Bucks County in Trevose, PA.

Surface Mount Technology Association (SMTA)

Find Inspiration for Innovation with New IPC APEX EXPO Activities in 2011

Industry News | 2011-01-12 17:40:04.0

Check out these Show Highlights, Ways to Save, Networking and Educational Opportunities, and Exhibition Preview.

Association Connecting Electronics Industries (IPC)

IPC Presents Technical Education Course: PCB Troubleshooting Course held in conjunction with PCB Carolina

Industry News | 2016-09-14 17:44:33.0

IPC – Association Connecting Electronics Industries® will present “PCB Troubleshooting” on November 2, 2016 in Raleigh, N.C. in conjunction with regional trade show, PCB Carolina.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

Gaining a Competitive Edge in Eastern Europe’s Fast-growing Electronics Assembly Market

Industry News | 2012-10-16 18:56:39.0

IPC — Association Connecting Electronics Industries® will hold “IPC Conference on Solderability and Reliability for Electronics Assemblies” on 6-7 February 2013, in Budapest, Hungary.

Association Connecting Electronics Industries (IPC)

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

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