Industry News: tackiness (Page 8 of 8)

Nordson MARCH's New Plasma Polymerization Deposition Systems Deposit Materials During Precision Manufacturing Processes

Industry News | 2017-02-07 16:19:24.0

Nordson MARCH introduces its PD Series Plasma Deposition Systems family, which uses plasma polymerization to deposit thin films uniformly during precision manufacturing and assembly processes to change the surface characteristics of a substrate. Plasma deposition can be used for applications in a wide range of industries, including medical, life sciences, industrial, semiconductor, MEMS, plastics, and electronics.

MARCH Products | Nordson Electronics Solutions

Indium Corporation to Present Power Module Poster at PCIM Asia

Industry News | 2021-08-26 11:17:24.0

Indium Corporation's Leo Hu, senior area technical manager – East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.

Indium Corporation

Indium Corporation to Feature Products for HIA and SiP at IMAPS Boston

Industry News | 2022-09-19 05:59:24.0

Indium Corporation® will feature innovative material solutions designed to meet the evolving challenges of SiP and HIA at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Indium Corporation

Heraeus Electronics provides latest materials portfolio for next-generation power electronics and semiconductor advanced packaging at NEPCON Japan 2023

Industry News | 2023-01-23 18:38:38.0

Heraeus Electronics returns to NEPCON Japan after two years of the pandemic. At the exhibition, which is scheduled to take place January 25-27, 2023, at The Tokyo Big Sight, Heraeus Electronics will bring a wide range of innovative materials to enhance power module and semiconductor device performance.

Heraeus

Heraeus Electronics showcases new portfolio for next-generation power electronics and semiconductor advanced packaging at SEMICON Korea 2023

Industry News | 2023-01-30 16:56:37.0

For the first time, Heraeus Electronics will exhibit at SEMICON Korea, scheduled to take place February 1-3, 2023, at COEX in Seoul, Korea. At the exhibition, Heraeus Electronics will show a wide range of innovative materials to enhance power modules and semiconductor device performance.

Heraeus

Indium Corporation to Showcase GalliTHERM™ Liquid Metal Technology and No-Clean Semiconductor Flux at SEMICON Taiwan

Industry News | 2022-08-14 14:12:26.0

Indium Corporation® is proud to feature its cutting-edge soldering and thermal materials at SEMICON Taiwan, September 14-16, in Taipei, Taiwan.

Indium Corporation

Heraeus Electronics to introduce new advanced solutions to further elevate device performance at SEMICON China 2023

Industry News | 2023-07-03 19:52:11.0

Heraeus Electronics is excited to announce its participation in SEMICON China, scheduled to take place June 29 - July 1, 2023 at the Shanghai New International Expo Center (SNIEC). Heraeus Electronics will showcase its innovative range of semiconductor packaging materials and printed electronics in booth E7355, Hall E7.

Heraeus

Previous 3 4 5 6 7 8  

tackiness searches for Companies, Equipment, Machines, Suppliers & Information

PCB Handling with CE

World's Best Reflow Oven Customizable for Unique Applications
Baja Bid Auction JUL 9-10, 2024

Reflow Soldering 101 Training Course
IPC Training & Certification - Blackfox

High Throughput Reflow Oven
Hot selling SMT spare parts and professional SMT machine solutions

"Find out how you can receive priority in SMTnet Search with out Sponsor membership."