Industry News | 2014-06-30 14:25:43.0
YINCAE Advanced Materials, LLC is pleased to announce the availability of the SMT 88 series. SMT 88 is a series of new underfill products that enable a faster cure while being held at room temperature.
Industry News | 2021-12-22 09:30:32.0
YINCAE is excited to announce that we have developed and upgraded SMT 88UL to SMT 88UL2, a fully flux residue compatible, room temperature fast flow and easily reworkable underfill.
Industry News | 2003-09-25 13:32:47.0
Reduce waste and cost.
Industry News | 2018-07-03 04:09:30.0
Solder migration or Squeeze Out can be seen when solder reflows on packages which are underfilled and is feature on the NPL Defect Database and shows you what is happening
Industry News | 2010-09-16 21:44:04.0
The Balver Zinn Group announces that Cobar Europe BV now distributes Yincae Advanced Materials’ SMT 158 Capillary Underfill and SMT 256 Individual Solder Joint Encapsulations throughout Europe.
Industry News | 2015-05-13 13:57:18.0
The current trend of miniaturization in microelectronics have paved the way for 3D packaging; allowing for lower manufacturing cost, increased memory and speed and a greater variation in functional uses of the miniaturized devices.
Industry News | 2018-05-14 10:30:22.0
The world's first commercial diamond filled underfill.
Industry News | 2019-03-12 08:54:28.0
(Albany, NY) March 12, 2019 YINCAE Advanced Materials is proud to announce that we will be exhibiting at this year’s IMAPS New England Symposium & Expo 2019, at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA. Additionally, Dr. Wusheng Yin, President of YINCAE, will be giving a presentation on our unique product, Zero Outgassing and Flux Residue-compatible Underfill.
Industry News | 2019-04-10 10:19:18.0
(Albany, NY) April 8, 2019 IMAPS New England Symposium & Expo 2019, will be held at the Boxboro Regency Hotel & Conference Center, in Boxborough, MA on May 7, 2019. YINCAE Advanced Materials hopes you will stop by our booth to learn more about YINCAE and the innovative products we have to offer: Solder Joint Encapsulants, Underfill Materials, Die Attach Adhesives, Thermal Interface Materials and more.
Industry News | 2023-03-27 14:51:47.0
We are thrilled to announce that YINCAE has some exciting news to share with you! We have recently introduced a breakthrough technology - thermal underfill UF 158A2 which can dramatically shorten the manufacturing process and improve the heat dissipation.
