Industry News | 2008-04-17 16:46:07.0
In what is truly a ground breaking material advance, Henkel Corporation has developed a new reflow cured encapsulant material that combines flux functionality and underfill protection into a single material. The breakthough product, Hysol� FF6000�, is a reflow curable material that is formulated to provide flux for lead-free solder joint formation and, when cured, delivers protection against mechanical stress.
Industry News | 2009-05-26 18:16:29.0
In a remarkable breakthrough for underfill materials development, Henkel has engineered and launched a new underfill system that delivers on an unprecedented array of complex and demanding requirements, including room temperature fast flow, low temperature cure and reworkability. The new material, Hysol� UF3800�, has been specifically designed for use with today's CSP and BGA devices and is particularly well-suited for handheld communication and entertainment applications.
Industry News | 2021-01-21 09:42:44.0
YINCAE is excited to announce that we have developed SMT 158D8 a high thermal conductive underfill that is capillary and fast-flowing, and an easy reworkable liquid epoxy.
Industry News | 2018-05-18 15:47:55.0
As chips and packages become more complex, and installed in harsher conditions such as automobiles, the thermal conductivity of underfill materials becomes a greater concern. What can be done to prevent decreased reliability due to thermal dissipation issues?
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2024-09-30 19:26:03.0
Essemtec is excited to exhibit at the SMTA International Expo, happening October 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. We invite you to visit us at Booth 2959 for live demonstrations of our latest technologies, including our innovative reballing solutions, the all-new Tarantula Underfill system, and the Fox all-in-one machine featuring the new Integrated Inspection System (I2S).
Industry News | 2018-02-14 10:15:17.0
Press Release YINCAE’S New High Purity Liquid Encapsulant: SMT 158HA
Industry News | 2018-05-08 13:42:49.0
SEMICON WEST 2018 is 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.
Industry News | 2018-08-16 19:42:31.0
Anda Technologies USA, Inc., a leading provider of fluid application and custom design manufacturing equipment, features a line of precision high-performance fluid dispensing and underfill systems. iJet-Table Dispenser Models 250 & 350 are useful for many applications such as SMT and PCB packaging, underfill, semiconductor packaging, LED packaging, electromechanical assembly, as well as flat panel assembly. The machines boast a max speed of 600 mm/second and 0.02 mm precision and repeatability.
Industry News | 2018-09-04 15:51:06.0
YINCAE is excited to announce that we have developed SMT 158HA, an underfill with zero outgassing that is fully compatible with flux material.
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