Industry News | 2011-02-07 15:28:03.0
Count On Tools Inc. introduces its new series of Custom SMT Pick-and-Place Nozzles for 0201 and 01005 Micro-Components. By working closely with a component manufacturer and leading EMS companies, Count On Tools guarantees secure picking of all fragile micro-components and accurate placement on the circuit board.
Industry News | 2011-03-11 14:17:49.0
Count On Tools Inc. will introduce its latest developments in SMT nozzles and consumables in Booth #1965 at the upcoming at the upcoming IPC APEX conference and exhibition, scheduled to take place April 12-14, 2011 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Industry News | 2018-09-26 11:45:32.0
On September 13, representatives from the e-textiles ecosystem, including product innovators, material suppliers, electrical engineers and academia, came together for IPC E-Textiles 2018, a first-time e-textiles event for IPC. The workshop was developed by leaders from the e-textiles supply chain, who approached IPC to host a collaborative educational event for two converging industries—textiles and electronics.
Industry News | 2018-10-23 20:30:54.0
Changing technologies that are driving the electronics industry will take center stage throughout the IPC APEX EXPO 2019 technical conference and professional development sessions, which will take place January 26-31 at the San Diego Convention Center in San Diego, California. Registration is now open at www.IPCAPEXEXPO.org.
Industry News | 2022-12-07 07:35:10.0
The Anti-Counterfeiting Forum, CALCE and SMTA are very pleased to announce that they will be jointly hosting the Counterfeit Electronics and Materials Symposium at the Manufacturing Technology Centre in Coventry, UK, on 14th and 15th March 2023. This international event will feature domain expert speakers from Europe and USA and builds on the history of past events held in the USA by SMTA and CALCE and by the Anti-Counterfeiting Forum in the UK.
Industry News | 2024-03-26 13:55:04.0
Today's system solutions combine more varied functionality, such as digital, analog, optical, micro-mechanical, etc., packed into smaller form factors. As a result, electronics manufacturing has to deliver increasingly complex integration of diverse technologies with system designs that blur the distinction between chip, package, board, and assembly.
Industry News | 2013-11-01 16:09:44.0
Eric Chason, Ph.D., professor of engineering at Brown University, will present his tin whisker research at the 7th International Tin Whiskers Symposium, November 12–13 in Costa Mesa, Calif., hosted by IPC with academic partner CALCE.
Industry News | 2020-02-18 15:10:01.0
IPC presented Committee Leadership, Special Recognition and Distinguished Committee Service Awards on February 3 and 5 at IPC APEX EXPO 2020 at the San Diego Convention Center. The awards were presented to individuals who made significant contributions to IPC and the industry by lending their time and expertise through IPC committee service.
Industry News | 2013-04-17 11:13:48.0
IPC ESTC will feature eight professional development courses examining packaging, materials, design and assembly considerations in electronics, from bare board to end-product, May 20–21 and May 23, 2013, at The New Tropicana in Las Vegas.
Industry News | 2014-05-12 16:06:39.0
SMTA China announces that it presented awards for nine papers at the SMTA China East 2014 Conference Award Presentation Ceremony, held on Wednesday, April 23, 2014 at Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.