Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2018-10-18 09:27:40.0
Time Temperature setting wave soldering is the most important in the solder melts
Industry News | 2018-10-18 08:32:52.0
How to Prevent Solder Ball and Bridging Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:17:09.0
How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process
Industry News | 2018-10-18 08:36:26.0
How the modern solder reflow oven works?
Industry News | 2018-10-18 08:44:36.0
Lead-free Reflow Profile: Soaking type vs. Slumping type
Industry News | 2018-10-18 08:27:03.0
An Analysis of SMT Solder Paste Printing Defects
Industry News | 2018-04-09 19:48:04.0
SMTA Europe announces Session 1 Technical Program on Predicting Component Life at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2011-07-23 00:11:26.0
The SMTA announced that the renamed Lead-Free Soldering Technology Symposium will be held on October 20, 2011 as a focused symposium at SMTA International in Ft. Worth, TX. The scope of this year's symposium is the reliability of interconnections, particularly those studied in the second phase of the NASA-DoD Pb-Free Consortium project.