Industry News | 2003-05-08 07:27:27.0
Easby Electronics is offering a line of low-cost plug and socket PCB terminal blocks in a vast range of styles and sizes, which now include 3.50 and 3.81mm pitches.
Industry News | 2012-08-09 18:42:34.0
IPC has released IPC-HDBK-850, Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly.
Industry News | 2017-02-02 10:26:34.0
Nordson ASYMTEK, a Nordson company will exhibit its latest and most popular technologies for fluid dispensing, jetting, conformal coating, and hot bar soldering in booth 1611 at the IPC APEX tradeshow, in San Diego, California, being held February 14-16, 2017. ASYMTEK is joining its sister Nordson companies to support IPC as it celebrates its 60th year in the electronics manufacturing industry.
Industry News | 2010-05-20 12:47:37.0
GAINESVILLE, GA ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces Universal Instruments’ GSM special low force (spring suspended) nozzle with replaceable tips for delicate components. Count On Tools’ new low force nozzles are ideal for gaas die, gallium arsenide, thin silicone (less than 0.10" in thickness), die with air bridges and flip chips.
Industry News | 2013-07-17 19:05:42.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-07-19 11:33:18.0
IPC — Association Connecting Electronics Industries® will host IPC APEX India™ on 26–29 August 2013 at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2013-02-25 18:32:14.0
Equipment Services, LLC has introduced a new line of ESE US-X Series solder-paste printers to the North American PCB assembly market. The advanced-technology SMT screen printers, which feature 2-D solder-paste inspection as standard, are built in Korea to the highest level of quality.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Industry News | 2010-05-11 15:23:38.0
To help electronics manufacturers be more productive and successful, the high complexity of the various steps in the SMT process chain requires that all participants develop innovative solutions jointly and as early as possible so that workflows can be simplified and improved.
