Processing and Troubleshooting SMT, BGA, CSP and Flip Chip
SMTnet Express, January 5, 2014, Subscribers: 23,708, Members: Companies: 14,158 , Users: 37,476 The Last Will And Testament of the BGA Void Dave Hillman, Dave Adams, Tim Pearson, Brad Williams, Brittany Petrick, Ross Wilcoxon - Rockwell Collins
Reliability of BGA Solder Joints after Re-Balling Process SMTnet Express October 4, 2012, Subscribers: 25550, Members: Companies: 9004, Users: 33746 Reliability of BGA Solder Joints after Re-Balling Process First published in the 2012 IPC APEX EXPO
Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment by: Jim Hines, Adam Stanczak
SMTnet Express July 11, 2013, Subscribers: 26149, Members: Companies: 13418, Users: 34911 Effect of BGA Reballing and its Influence on Ball Shear Strength by S. Manian Ramkumar Ph.D., Andrew J. Daya, Daniel B. Lewanda; Rochester Institute
Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers Metal Microchannel Lamination Using Surface Mount Adhesives for Low-Temperature Heat Exchangers by: Prawin, Paulraj , Paul, Brian K.; OSU School
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Training Provider / Events Organizer / Association / Non-Profit
6600 City W Pkwy
Eden Prairie, MN USA
Phone: 952-920-7682
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