. During QFP analysis, for example, the rotational acc
SMT Express, Volume 5, Issue No. 3 - from SMTnet.com Return to Front Page << Back to Page 3 Page 5 >> Thirdly, the actual measurement of component placement starts. During QFP analysis, for example, the rotational accuracy can
Lead-free and Tin-lead Assembly and Reliability of Fine-pitch Wafer-Level CSPs News • Forums • SMT Equipment • Company Directory • Calendar • Career Center • Advertising • About • FREE Company Listing! Lead-free and Tin-lead Assembly
SMTnet Express, March 3, 2022, Subscribers: 25,842, Companies: 11,529, Users: 27,083 Component Reliability After Long Term Storage Each year the semiconductor industry routes a significant volume of devices to recycling sites
Semiconductor *Long-term storage of BGA & QFP produ
SMTnet Express, May 3, 2018, Subscribers: 31,026, Companies: 10,927, Users: 24,677 Hot Air vs. IR BGA Rework Stations Dennis O'Donnell; Precision PCB Services, Inc Hot Air and IR are the two main types of rework stations used by OEMs and PCB
winsouce.jpg)
.gif)