The Environmental Cost of Green The Environmental Cost of Green Being involved in the electronics assembly industry for more than 23 years, specifically in the field of defluxing and cleanliness testing, I have seen my share of environmental
High Voltage Chip Resistors High Voltage Chip Resistors Many component engineers are faced with a circuit requirement calling for resistors having voltage ratings well above that associated with surface mount chip resistors, but below the level
Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113 Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission
Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
