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Manufacture and Characterization of a Novel Flip-Chip Package Z-interconnect Stack-up with RF Structures

Solder Materials Science Gets Small as Miniaturization Challenges Old Rules

DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

New BGA Solder Mask Repair Technique Using Laser Cut Stencils

BGA Rework. A Comparative Study of Selective Solder Paste Deposition For Area Array Packages

Real-Time Yield Monitoring Through ERP Systems

A New Stencil Rulebook for Wafer Level Solder Ball Placement using High Accuracy Screen Printing

Fundamentals of Solder Paste Technology

Design Environment ROI: How Design Teams On A Budget Can Build A Best In Class Design Environment

Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity

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Reflow Soldering 101 Training Course

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