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SMT Placement for ICs, Connectors and Odd Shaped Components

Laser Solder Reflow: A Process Solution, Part 2

SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

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SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control

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Using JTAG Emulation for Board-Level Functional Test

PTH - Reliability from Chip Carriers to Thick Printed Wiring Boards

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DOE for Process Validation Involving Numerous Assembly Materials and Test Methods

Cleanliness of Stencils and Cleaned Misprinted Circuit Boards

Testing Digital Designs - The Boundary-scan Balance

A NEW PARADIGM FOR DESIGN THROUGH MANUFACTURE