139 enclosed and flow results

Defect Free QFN Assembly

Defect Free QFN Assembly Defect Free QFN Assembly The problem with soldering QFN packages is that they float, skew and tilt on the 'domed' melted solder during the SMT re-flow process. This floating, skewing and/or tilting will lead to solder

Solder Charge Grid Array: Advancements In The Technology Of Surface Mount Area Array Solder Joint Attachment

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

Elemental Compositions of Over Two Dozen Cell Phones

SMTnet Express January 31 - 2013, Subscribers: 26152

SMTnet Express - January 30, 2014

SMTnet Express - April 17, 2014

SMTnet Express, April 17, 2014, Subscribers: 22675, Members: Companies: 13858, Users: 36080 A Novel Low Temperature Fast Flow And Fast Cure Reworkable Underfill Dr. Mary Liu and Dr. Wusheng Yin; YINCAE Advanced Materials, LLC. In order to meet

SMTnet Express - July 17, 2014

SMTnet Express - July 16, 2015

SMTnet Express - December 7, 2016