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A Study of PCB Insertion Loss Variation in Manufacturing Using a New Low Cost Metrology

Thermal Characteristics of PCB Laminates used in High Frequency Applications

New Developments in PCB Laminates

An Investigation of Whisker Growth on Tin Coated Wire and Braid

Corrosion Resistance of Different PCB Surface Finishes in Harsh Environments

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

The Regulatory and Environment Status of Tetrabromobisphenol-A In Printed Wiring Boards

Pad Cratering - The Invisible Threat to the Electronics Industry

A Novel Material for High Layer Count and High Reliability Printed Circuit Boards

Reliability of BGA Solder Joints after Re-Balling Process

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