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Tin Whiskering on PCBA Capacitors in Storage (Inside ESD Bag, Inside a Sealed Cardboard Box)

The Environmental Cost of Green

Screening for Counterfeit Electronic Components

Accurate Quantitative Physics-of-Failure Approach to Integrated Circuit Reliability

SMTnet Express - Septemeber 29, 2016

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Gold Wire Bonding Performance and Reliability of ENEPIG Surface Finishes

SMT Express, Volume 2, Issue No. 7 - from SMTnet.com

Defect Coverage for Non-Intrusive Board Tests

Stencil Design using Regression

Re-Shoring or Near-Shoring Concepts Should be Strongly Considered when the OEM's Goal is To Deliver Optimum Balance between Landed Cost and Time to Market

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