SMT Express, Volume 2, Issue No. 3 - from SMTnet.com Volume 2, Issue No. 3 Thursday, March 16, 2000 Featured Article Return to Front Page Curtailing Voids in Fine Pitch Ball Grid Array Solder Joints by Gary Morrison and Kevin Lyne
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 30, (#ts#)) SMT Express, Volume 2, Issue No. 11 - from SMTnet.com Volume 2, Issue No. 11 Friday, November 17, 2000
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 17, (#ts#)) SMT Express, Volume 2, Issue No. 5 - from SMTnet.com Volume 2, Issue No. 5 Wednesday, May 17, 2000
INSERT INTO tracking_express (userid, username, page_id, ts) VALUES ('#Quser_profile.id#', '#Quser_profile.username#', 28, (#ts#)) SMT Express, Volume 2, Issue No. 10 - from SMTnet.com Volume 2, Issue No. 10 Friday, October 20, 2000
SMTnet Express, July 16, 2020, Subscribers: 28,512, Companies: 11,045, Users: 25,964 Via In Pad - Conductive Fill or Non-Conductive Fill? Credits: Advanced Circuits In the early 2000s the first fine-pitch ball grid array devices became popular
