Are Separate Solder Flip-Chip Bonders Still Required? Are Separate Solder Flip-Chip Bonders Still Required? Increasing miniaturization is now encouraging manufacturers of handheld devices to stack bare dies or packages. As the process
SMTnet Express June 13, 2013, Subscribers: 26140, Members: Companies: 13397, Users: 34803 Electromigration damage mechanics of lead-free solder joints under pulsed DC: A computational model by: Wei Yao, Cemal Basaran; Electronic Packaging
SMTnet Express, October 17, 2013, Subscribers: 26325, Members: Companies: 13458, Users: 35281 Corrosion Resistance of Pb-Free and Novel Nano-Composite Solders in Electronic Packaging by L.C. Tsao; National Pingtung University of Science
