decade, depositing adhesives for SMT components on th
SMT Express, Volume 5, Issue No. 7 - from SMTnet.com Aligning the design and supply chains Component selection is often based on design and technology needs alone, with little thought given to downstream supply chain/manufacturing concerns
SMTnet Express, April 22, 2021, Subscribers: 27,222, Companies: 11,340, Users: 26,602 Effect Of Vacuum Reflow On Solder Joint Voiding In Bumped Components Voids affect the thermal characteristics and mechanical properties of a solder
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