73 stress results

Modelling of Thermal Stresses in Printed Circuit Boards

Modelling of Thermal Stresses in Printed Circuit Boards Modelling of Thermal Stresses in Printed Circuit Boards Results of FEM modelling of thermal stress analysis in printed circuit boards are given in the article. It is shown that thermal

SMT Express, Volume 2, Issue No. 11 - from SMTnet.com

SMTnet Express - March 7, 2019

SMTnet Express, March 7, 2019, Subscribers: 31,716, Companies: 10,725, Users: 25,814 Effect of Encapsulation Materials on Tensile Stress during Thermo-Mechanical Cycling of Pb-Free Solder Joints Credits: DfR Solutions Electronic assemblies use a

Technical Overview of Flex Mitigation Solutions

Technical Overview of Flex Mitigation Solutions

SMT Express, Issue No. 2 - from SMTnet.com

SMTnet Express - August 12, 2021

SMTnet Express, August 12, 2021, Subscribers: 26,820, Companies: 11,423, Users: 26,800 Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board In this article

Use of Non Etching Adhesion Promoters in Advanced PCB Applications

SMTnet Express March 21 - 2013, Subscribers: 26266

SMTnet Express April 18 - 2013, Subscribers: 26335