THT in-line Inspection: Contradiction or greater Efficiency? THT in-line Inspection: Contradiction or greater Efficiency? The utilisation of Automated Optical Inspection systems has become an integral part in quality assurance of electronic
SMTnet Express, April 30, 2020, Subscribers: 36,108, Companies: 10,995, Users: 25,780 Selective Solder Fine Pitch Components On High Thermal Mass Assembly Credits: ITW EAE The number of through-hole components on PCBs has declined significantly
Fundamentals of Solder Paste Technology Fundamentals of Solder Paste Technology Solder pastes are key materials in surface mount technology (SMT) for assembly of printed circuit boards (PCBs). Introduction of lead-free has placed new demands
SMTnet Express, September 30, 2021, Subscribers: 26,663, Companies: 11,449, Users: 26,872 Solutions for Selective Soldering of High Thermal Mass and Fine-Pitch Components The selective soldering process has evolved to become a
Head-in-Pillow BGA Defects Head-in-Pillow BGA Defects. Head-in-pillow (HiP), also known as ball-and-socket, is a solder joint defect where the solder paste deposit wets the pad, but does not fully wet the ball. This results in a solder joint
smeared solder paste pattern. A typical pad size for
