SMTnet Express, July 24, 2014, Subscribers: 22981, Members: Companies: 13953, Users: 36523 Copper Wire Bond Failure Mechanisms. Randy Schueller, Ph.D.; DfR Solutions Wire bonding a die to a package has traditionally been performed using either
A Practical Guide to Achieving Lead-Free Electronics Assembly A Practical Guide to Achieving Lead-Free Electronics Assembly AIM Credit/Source: Karl Seelig, David Suraski To successfully achieve lead-free electronics assembly, each participant
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